NGFF(M.2) Nvme M Key SSD To PCI- E 1X Adapter With Heatsink vertical Installatio

Product Specification

NGFF(M.2) nvme M key SSD to PCI- E 1X Adapter with Heatsink(vertical installation).

Product features:

1.Allows user to use standard M.2 M-Key nVME SSD to PCIe x1/x4/x8/x16 slot of the Desktop PC, But speed at 1X speed only

2.Support 2230/2242/2260/2280 type M.2 Card dimension

3. Only support M.2 Socket 3 PCI-e-based M Key SSD, doesn’t support M.2 SATA bus B key SSD

Package contents:

1x M.2 SSD to PCI- E 1X adapter

1x Quick Start Guide

1x M.2 SSD Heatsink

2x Heat-Conducting Silica Gel Pad(1 PCS thickness and 1PCS thin)

2x Wipes(1 PCS wet and 1 PCS dry):

2X Silica Gel Ring

2x M2 Screw

1x screw driver

M. 2 NVMe SSD to PCI-E 4X Adapter Professional Technical Analysis and Application Guide.

Against the backdrop of the continuous evolution of storage device interface technology, M.2 NVMe SSDs have become the mainstream choice for high-end storage due to their excellent read and write performance. However, compatibility issues with device interfaces often limit their performance. This M.2 NVMe SSD to PCI-E 4X adapter is based on a rigorous technical architecture and professional design, providing users with an efficient and stable storage interface conversion solution.

1. Interface protocol adaptation:

The adapter is equipped with a slot that complies with the NGFF (M.2) Key-m standard, designed specifically for M.2 SSDs that support NVMe protocol. Implement protocol conversion from M.2 NVMe SSD interface to PCI-E 4.0 x4 interface through internal circuit architecture. The PCI-E 4.0 standard has a single channel bandwidth of 2GB/s and a four channel theoretical bandwidth of up to 16GB/s, fully unleashing the performance potential of NVMe SSDs and meeting users' demanding requirements for high-speed data transmission. Both sequential and random read/write scenarios can achieve efficient data transmission and reduce I/O waiting time.

2. Main control chip solution:

Built in professional grade PCIe Switch controller chip (such as PLX PEX8601 or equivalent chip), supports NVMe 1.4 protocol full function transparent transmission, including core features such as namespace management and hot plug. The chip integrates CDR (Clock Data Recovery) circuit, which can effectively eliminate signal jitter and transmission loss under high-speed data transmission of PCI-E 3.0 16GT/s, ensuring the stability and accuracy of data transmission. At the same time, it supports PCI-E Link State Auto Negotiation (LTSSM), which can automatically adapt according to the PCI-E slot version (/3.0/2.0) of the motherboard, achieving backward compatibility.

Full specification compatibility design:

The adapter is fully compatible with NVMe protocol M.2 SSDs of four specifications: 2230, 2242, 2260, and 2280. By using a precisely designed Key-m slot structure, precise physical positioning and electrical connection of SSDs of different lengths can be achieved. In terms of electrical characteristics, optimization is carried out for the power requirements and signal characteristics of various specifications of SSDs to ensure stable power supply and signal transmission when NVMe SSDs of different capacities and brands are connected, avoiding compatibility issues caused by differences in specifications.

Professional level heat dissipation solution:

(1) Application of Thermal Silicone Technology:

Using high-performance thermal conductive silicone, with a thermal conductivity coefficient of up to 6.2W/m · K, it has excellent thermal conductivity. The working temperature range of silicone is -50 ℃ to 200 ℃, and it can maintain stable physical and chemical properties even in extreme environments. Through precision dispensing technology, the thickness of the silicone layer is uniformly controlled at 0.15 ± 0.03mm, effectively reducing the thermal resistance between the SSD and the heat sink, improving thermal conductivity efficiency, and achieving rapid heat dissipation. ​

(2) Heat sink engineering design:

The heat sink is made of 6063-T5 aluminum alloy material, which has a thermal conductivity of 180W/m · K and excellent heat dissipation performance. By using CNC precision machining technology, the heat sink is made into a multi fin structure, greatly increasing the heat dissipation surface area. Taking the heat sink compatible with 2280 SSD as an example, its size is 80mm × 22mm × 15mm, including 24 fins, with a heat dissipation area of 320cm ². The heat sink and SSD are fixed in a spring buckle design, ensuring a tight fit while avoiding physical damage to the SSD due to excessive compression. ​

(3) Actual measurement of heat dissipation efficiency:

After professional testing, the NVMe SSD with 2280 specifications and 8W power consumption was continuously read and written at room temperature of 25 ℃. Compared with no heat dissipation measures, the heat dissipation scheme of this adapter can reduce the temperature of the SSD main control chip by 25 ℃, effectively controlling the full load temperature within 70 ℃, ensuring that the performance of the SSD does not deteriorate under long-term high load operation, and data transmission is stable and reliable.

Installation and Technical Parameters

(1) Convenient installation process:
Physical connection: Insert the NVMe protocol M.2 SSD smoothly into the adapter slot along the Key-m slot anti misoperation port direction, and ensure that the SSD is fully engaged in the fixed buckle. ​

Device access: Align the PCI-E 4X gold finger of the adapter vertically with the PCI-E 4.0/3.0 x4/x8/x16 slot on the desktop or server motherboard (supporting automatic speed reduction adaptation), and insert it evenly until it fits perfectly. ​

System recognition: After the device is powered on, the system will automatically recognize the NVMe SSD connected, and users can perform initialization, partitioning, formatting, and other operations in disk management.