Silicone Thermal Paste Grease DOWSIL TC-5622 1Kg For Construction / Transportati

Product Specification

DOWSIL TC-5622 1Kg Thermal Paste High Thermal Conductivity Silicone Grease For Construction And Transportation​

Basic Product Properties

• ​​Thermal Conductivity​​: 4.3 W/m·K
• ​​Color​​: Gray
• ​​Viscosity​​: 95,000 mPa·s
• ​​Form​​: Grease-like consistency
• ​​Key Components​​: Silicone-based grease with high-conductivity metal oxides

Product Introduction

DOWSIL™ TC-5622 is a high-performance thermal compound based on silicone grease, specifically designed to address thermal management challenges in electronic devices. Its unique formulation combines high-conductivity metal oxides with a silicone matrix, significantly enhancing heat dissipation efficiency while maintaining excellent electrical insulation properties. This product dual-functions as a thermal conductor and adhesive, forming a stable rubber-like sealant layer, making it suitable for high-end microprocessors, power electronic components, and other similar applications. Its low thermal impedance and long-term thermal stability ensure reliable performance even under high-stress or high-temperature environments.

Advanced Product Features

1. ​​Superior Thermal Conductivity​​
   TC-5622 delivers thermal efficiency ​​10%–15% higher​​ than standard thermal greases on average, rapidly dissipating heat generated by chips to reduce device operating temperatures.

2. ​​Wide Temperature Range Stability​​
   It maintains chemical stability across extreme temperatures (-50°C to 200°C), preventing material failure caused by mismatched coefficients of thermal expansion.

3. ​​Ease of Processing​​
   With a viscosity of 95,000 mPa·s, it offers high fluidity, enabling precise application via screen printing or stencil printing to simplify manufacturing processes.

4. ​​Broad Compatibility​​
   It is compatible with a wide range of substrates, including plastics, ceramics, and metals (e.g., aluminum, copper), and forms strong bonds without requiring a primer.

Application Scenarios

1. ​​Electronic Device Heat Dissipation​​

   • ​​CPU/GPU Packaging​​: Used in high-power-density heat dissipation for laptop and server chips to mitigate thermal runaway risks.
   • ​​Power Modules​​: Suitable for insulation and thermal conduction in IGBT, SiC, and other power semiconductor devices.

2. ​​Industrial Equipment​​

   • ​​Power Modules​​: Optimizes thermal conduction paths in AC-DC/DC-DC converters.
   • ​​Sensors and Transistors​​: Protects PTC heating elements or NTC temperature sensors from overheating damage.

3. ​​New Energy Sector​​

   • ​​Electric Vehicle Battery Management System (BMS)​​: Ensures uniform temperature distribution within battery packs to extend service life.
   • ​​Photovoltaic Inverters​​: Enhances inverter efficiency and reduces downtime risks caused by overheating.

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination