Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days |
| Packaging Details | 12kg per carton, 31*27*20cm |
| Base material | RO4535 |
| Tg | 288 |
| Layer count | 2 layers |
| Solder mask | Green |
| Surface finish | Immersion gold |
| PCB thickness | 0.6mm |
| Copper weight | 1oz |
| Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-189-V2.0 |
| Certification | UL |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 50000 pieces per month |
| Delivery Time | 10 working days | Packaging Details | 12kg per carton, 31*27*20cm |
| Base material | RO4535 | Tg | 288 |
| Layer count | 2 layers | Solder mask | Green |
| Surface finish | Immersion gold | PCB thickness | 0.6mm |
| Copper weight | 1oz | Brand Name | Bicheng Technologies Limited |
| Model Number | BIC-189-V2.0 | Certification | UL |
| Place of Origin | CHINA | ||
| High Light | high frequency circuit design ，high speed pcb | ||
Rogers RO4535 High Frequency Printed Circuit Board 60mil 30mil 20mil RO4535 Antenna RF PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
RO4535 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.44 and a loss tangent (Df) of 0.0037 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.
It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4535 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.
Features and Benefits
1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability: Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling
Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks
Our PCB Capability (RO4535)
| PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
| Designation: | RO4535 |
| Dielectric constant: | 3.44 |
| Dissipation Factor | 0.0037 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
RO4535 Typical Values
| Property | RO4535 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.44 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.0032 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0037 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 16 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 17 | Y | ||||
| 50 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.09 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.9 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 5.1 (0.9) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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