Payment Terms | T/T, Western Union |
Supply Ability | 45000 pieces per month |
Delivery Time | 10 working days |
Packaging Details | Vacuum |
Number of Layers | 1 |
Board Material | Polyimide 25µm |
Surface Cu thickness | 1.0 |
Board Thickness | 0.15 mm +/-10% |
Surface Finish | Immersion Gold |
Solder Mask Color | Yellow |
Colour of Component Legend | White |
Test | 100% Electrical Test prior shipment |
Brand Name | Bicheng Enterprise |
Model Number | BIC-276-V2.76 |
Certification | UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T, Western Union | Supply Ability | 45000 pieces per month |
Delivery Time | 10 working days | Packaging Details | Vacuum |
Number of Layers | 1 | Board Material | Polyimide 25µm |
Surface Cu thickness | 1.0 | Board Thickness | 0.15 mm +/-10% |
Surface Finish | Immersion Gold | Solder Mask Color | Yellow |
Colour of Component Legend | White | Test | 100% Electrical Test prior shipment |
Brand Name | Bicheng Enterprise | Model Number | BIC-276-V2.76 |
Certification | UL | Place of Origin | China |
Engineering Thermal Excellence for Demanding RF Applications
Rogers RT/duroid 6035HTC was developed through extensive material formulation to handle the punishing thermal requirements of kW-level RF circuits. Crafted from a proprietary ceramic-filled PTFE composite, it achieves class-leading thermal dissipation without compromising electrical performance.
This starts from the laminate core, which maintains a precisely calibrated Dk of 3.5 ±0.05 across frequencies to 10GHz. Its dissipation factor of just 0.0013 further ensures transmission lines exhibit minimal losses.
Where 6035HTC really shines is its thermal properties. With a thermal conductivity of 1.44 W/mK, it outperforms even some of the highest performing aluminum oxide-filled laminates on the market. This allows circuits to continuously dissipate enormous power loadings without risk of damage.
Dimensionally, 6035HTC maintains tight 19ppm CTE values from -55°C to 260°C. This dimensional stability prevents warping even as assemblies undergo rapid thermal cycling.
Our ISO 9001 plant produces 6035HTC-based boards to IPC Class 3 workmanship using a controlled drilling process tailored to its composition. Standard board sizes are available or can be custom cut up to 3m x 1.5m.
Power amplifier, phased array and radar designers have come to rely on 6035HTC's unparalleled ability to move heat away from active devices. Contact us to discuss how its meticulously engineered properties can boost the reliability of your most demanding RF applications.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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