Payment Terms | T/T, Paypal |
Supply Ability | 45000 pieces per month |
Delivery Time | 4-5 working days |
Packaging Details | Vacuum |
PCB Material | Woven Fiberglass reinforced PTFE Laminates |
Board Thickness | 0.787-3.175mm |
Surface Cu thickness | 2 oz |
Surface Finish | Immersion gold, HASL, Immersion silver, Immersion tin |
Solder Mask Colour | Green, Black, Blue, Red, Yellow etc. |
Color of Silkscreen | Green, Black, Blue, Red, Yellow etc. |
Function | 100% Pass electrical test |
Brand Name | Bicheng Enterprise Limited |
Model Number | BIC-211-V1.0 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T, Paypal | Supply Ability | 45000 pieces per month |
Delivery Time | 4-5 working days | Packaging Details | Vacuum |
PCB Material | Woven Fiberglass reinforced PTFE Laminates | Board Thickness | 0.787-3.175mm |
Surface Cu thickness | 2 oz | Surface Finish | Immersion gold, HASL, Immersion silver, Immersion tin |
Solder Mask Colour | Green, Black, Blue, Red, Yellow etc. | Color of Silkscreen | Green, Black, Blue, Red, Yellow etc. |
Function | 100% Pass electrical test | Brand Name | Bicheng Enterprise Limited |
Model Number | BIC-211-V1.0 | Certification | UL |
Place of Origin | China |
Rogers DiClad 870 Woven Fiberglass Reinforced PTFE-based 31mil 93mil 125mil Microwave PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
DiClad 870 laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. In comparison to nonwoven fiberglass reinforced PTFE-based laminates of comparable dielectric constants, the woven fiberglass reinforcement in DiClad 870 provides greater dimensional stability.
DiClad 870 laminates offer lower dielectric constants (Dk) and dissipation factors at a similar thickness as other laminates in the DiClad series by using fewer plies of woven fiberglass and a higher ratio of PTFE content.
Features & Benefits
Our PCB Capability (DiClad 870)
PCB Capability (DiClad 870) | |
PCB material: | Woven Fiberglass reinforced PTFE Laminates |
Designation: | DiClad 870 |
Dielectric constant: | 2.3 |
Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
Dielectric thickness: | 31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm) |
Copper weight: | 1oz (35µm), 2oz (70µm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Red, Yellow etc. |
Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, Pure gold plated etc.. |
Typical Applications
1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, LNAs
4. Guidance Systems
5. Low Loss Base Station Antennas
6. Radar Feed Networks
Our Advantages
1. Wide ranges of high frequency materials: Rogers, Taconic, Wangling, Isola, Shengyi etc.
2. 16000㎡ workshop; 30000㎡ output capability per month; 8000 types of PCB's per month;
3. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
4. Quick CADCAM checking and free PCB quotation;
5. More than 20+ years of high frequency PCB experience;
6. Diversified shipping method: FedEx, DHL, TNT, EMS;
7. No MOQ, low cost for prototypes and small runs quantity;
8. Delivery on time: >98% ; Customer complaint rate: <1%
Appendix: Data sheet of DiClad 870
Property | DiClad 870 | Condition | Test Method |
Electrical Properties | |||
Dielectric Constant @ 10 GHz | 2.33 | C23/50 | IPC TM-650 2.5.5.5 |
Dielectric Constant @ 1 MHz | 2.33 | C23/50 | IPC TM-650 2.5.5.3 |
Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
Dissipation Factor @ 1 MHz | 0.0009 | C23/50 | IPC TM-650 2.5.5.3 |
Thermal Coefficient of Er (ppm/°C) | -161 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
Volume Resistivity (MΩ-cm) | 1.5 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
Surface Resistivity (MΩ) | 3.4 x 10 7 | C96/35/90 | IPC TM-650 2.5.17.1 |
Arc Resistance | >180 | D48/50 | ASTM D-495 |
Dielectric Breakdown (kV) | >45 | D48/50 | ASTM D-149 |
Mechanical Properties | |||
Peel Strength (lbs.per inch) | 14 | After Thermal Stress | IPC TM-650 2.4.8 |
Tensile Modulus (kpsi) | 485(MD), 346(CD) | A, 23°C | ASTM D-638 |
Tensile Strength (kpsi) | 14.9(MD), 11.2 (CD) | A, 23°C | ASTM D-882 |
Compressive Modulus (kpsi) | 327 | A, 23°C | ASTM D-695 |
Flexural Modulus (kpsi) | 437 | A, 23°C | ASTM D-790 |
Thermal Properties | |||
Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis | 17 29 217 | 0°C to 100°C | IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer |
Thermal Conductivity (W/mK) | 0.257 | 100°C | ASTM E-1225 |
Flammability UL | Meets requirements of UL94-V0 | C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
Physical Properties | |||
Density (g/cm3) | 2.26 | A, 23°C | ASTM D-792 Method A |
Water Absorption (%) | 0.02 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | 0.02 0.00 0.01 NO | 125°C, ≤ 10-6 torr | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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