Payment Terms | T/T,Paypal |
Supply Ability | 50000 PIECE PER MONTH |
Delivery Time | 8-9 WORKING DAY |
Packaging Details | VACUUM |
Board Material | PI, PET |
Board Thickness | 0.03mm-3.0mm |
Surface/Inner layer Cu thickness | 0.5oz, 1oz, 2oz |
Surface Finish | Immersion Gold, Immersion Sliver, Immersion Tin |
Coverlay Colour | Yellow, White, Black, Green |
Color of Silkscreen | Yellow, White, Black, Green |
Function | 100% Pass electrical test |
Number of Layers | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
Brand Name | Bicheng Enterprise Limited |
Model Number | BIC-0339-V3.34 |
Certification | UL |
Place of Origin | CHINA |
View Detail Information
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Product Specification
Payment Terms | T/T,Paypal | Supply Ability | 50000 PIECE PER MONTH |
Delivery Time | 8-9 WORKING DAY | Packaging Details | VACUUM |
Board Material | PI, PET | Board Thickness | 0.03mm-3.0mm |
Surface/Inner layer Cu thickness | 0.5oz, 1oz, 2oz | Surface Finish | Immersion Gold, Immersion Sliver, Immersion Tin |
Coverlay Colour | Yellow, White, Black, Green | Color of Silkscreen | Yellow, White, Black, Green |
Function | 100% Pass electrical test | Number of Layers | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
Brand Name | Bicheng Enterprise Limited | Model Number | BIC-0339-V3.34 |
Certification | UL | Place of Origin | CHINA |
Revealing Our Latest Microwave Masterpiece
We’re thrilled to unveil our newest feat of circuitry craftsmanship - a two-layer tour de force destined to revolutionize GHz applications.
Constructed from Rogers’ ultra-pure RO4730G3 substrate, this technical triumph delivers pristine signal integrity from icy -40°C all the way to a scorching 85°C. With a dielectric constant of 3.0 and miniscule dissipation factor, microwave marvels materialize where lesser boards fall short.
Squeezed into a miniature footprint of just 136x97mm yet jam-packed with a dense array of 106 discrete components, its micro-precision design maximizes real estate utilization. Razor-sharp 6/4mil accuracy and resin-encapsulated, gold-plated vias as thin as a human hair enable seamless interlayer transit at light speed.
Across two board configurations, our master artisans infused each pristine copper skin with 1oz of pure 2-micron cladding for untouched propagation along 16 dedicated signal pathways. An intricate network of 192 vias dive deep within to dexterously disseminate RF oscillations.
Exhaustive electrical evaluation and thermal cycling proved this technical tour de force is fully ready for rigorous mission-critical applications at the cutting edge of next-gen technologies.
Gerber data files conforming to IPC-2581 standards were received and production adhered to stringent IPC Class 2 requirements. Extensive electrical testing procedures were conducted on the completed boards prior to shipping to validate full functionality.
Any other technical queries may be directed to Sally Mao at sales@bichengpcb.com. We are pleased to have facilitated this innovative RF solution and remain open to future collaboration on projects advancing design boundaries.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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