Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Brand Name | AGC |
| Model Number | TSM-DS3 PCB |
| Certification | ISO9001 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Brand Name | AGC | Model Number | TSM-DS3 PCB |
| Certification | ISO9001 | Place of Origin | China |
TSM-DS3 PCB: 2-Layer, 30mil Core, 0.8mm Thickness with Immersion Gold Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of TSM-DS3 2-Layer PCB
The TSM-DS3 PCB is a high-performance 2-layer rigid PCB designed for high-power, low-loss, and thermally stable applications. Built with TSM-DS3 materials, this PCB features a 30mil (0.762mm) core and a finished thickness of 0.8mm, providing low dielectric loss and excellent thermal conductivity.
With a dielectric constant (Dk) of 3.0 ± 0.05 and dissipation factor (Df) of 0.0014 at 10 GHz, the TSM-DS3 PCB is a reliable choice for radar systems, phased array antennas, and high-frequency automotive applications. The Immersion Gold (ENIG) surface finish ensures excellent solderability, corrosion resistance, and long-term durability.
PCB Construction Details
| Parameter | Specification |
| Base Material | TSM-DS3 |
| Layer Count | 2 layers |
| Board Dimensions | 68mm x 126mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Thickness | 0.8mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Green |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Dielectric Layer | TSM-DS3 Core | 0.762mm (30mil) |
| Copper Layer 2 | Copper (1oz) | 35μm |
Introduction to TSM-DS3 Material
The TSM-DS3 laminates are ceramic-filled, reinforced materials with minimal fiberglass content (~5%), developed for high-power RF applications. These materials provide dimensional stability, low loss, and thermal reliability, combining the benefits of ceramics and traditional epoxy laminates.
Key Features of TSM-DS3
Dielectric Constant (Dk): 3.0 ± 0.05 at 10GHz / 23°C.
Dissipation Factor (Df): Low at 0.0014 at 10GHz.
Thermal Conductivity: 0.65 W/m·K for optimal heat dissipation.
Moisture Absorption: Extremely low at 0.07%.
CTE (Coefficient of Thermal Expansion): X-axis: 10 ppm/°C. Y-axis: 16 ppm/°C. Z-axis: 23 ppm/°C.
Temperature Stable Dk: ±0.25% from -30°C to 120°C.
Benefits of TSM-DS3
Applications
Couplers
Phased Array Antennas
Radar Manifolds
Millimeter Wave Antennas
Automotive Applications
Oil Drilling Equipment
Semiconductor/ATE Testing
Conclusion
The TSM-DS3 2-layer PCB is a premium solution for high-frequency, high-power PCB designs, offering low dielectric loss, thermal stability, and dimensional reliability. With its 30mil TSM-DS3 core, Immersion Gold finish, and green solder mask, this PCB is ideal for applications such as radar manifolds, phased array antennas, and semiconductor testing.
Compliant with IPC-Class-2 standards and available worldwide, the TSM-DS3 PCB is the perfect choice for engineers seeking cost-effective, high-performance materials for complex, high-frequency designs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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