Shenzhen Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T, Paypal |
| Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days |
| Packaging Details | Packing |
| Product Copper Thickness | 0.5-6.0oz |
| Color Of Silkscreen | Yellow, White, Black, Green |
| Product Silkscreen | White, Black, Yellow |
| Solder Mask Colour | N/A |
| Product Min. Hole Size | 0.2mm |
| Base Material | M6 High Speed material + High Tg FR-4 |
| Model | BIC-N05-05 |
| Final Foil External | 1 oz |
| Product Surface Finish | HASL, Lead Free HASL, ENIG, Immersion Silver, OSP, Gold Plating |
| Silkscreen | White |
| Product Thickness | 0.2-6.0mm |
| Silkscreen Color | White |
| Customer Support | 24/7 customer support |
| Thermal Conductivity | 1W/MK dielectric material, MCPCB |
| Brand Name | Panasonic |
| Model Number | M6 High Speed material + High Tg FR-4 |
| Certification | ISO9001 |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
| Delivery Time | 2-10 working days | Packaging Details | Packing |
| Product Copper Thickness | 0.5-6.0oz | Color Of Silkscreen | Yellow, White, Black, Green |
| Product Silkscreen | White, Black, Yellow | Solder Mask Colour | N/A |
| Product Min. Hole Size | 0.2mm | Base Material | M6 High Speed material + High Tg FR-4 |
| Model | BIC-N05-05 | Final Foil External | 1 oz |
| Product Surface Finish | HASL, Lead Free HASL, ENIG, Immersion Silver, OSP, Gold Plating | Silkscreen | White |
| Product Thickness | 0.2-6.0mm | Silkscreen Color | White |
| Customer Support | 24/7 customer support | Thermal Conductivity | 1W/MK dielectric material, MCPCB |
| Brand Name | Panasonic | Model Number | M6 High Speed material + High Tg FR-4 |
| Certification | ISO9001 | Place of Origin | China |
6-Layer Rigid PCB with M6 Material, High Tg FR-4, Resin-Filled Vias, and ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Today I’m excited to introduce our 6-layer rigid PCB made with a combination of M6 high-speed material and High Tg FR-4. This PCB is designed for high-frequency applications, delivering exceptional thermal performance, low signal loss, and mechanical reliability. It features copper coin embedding, resin-filled and capped vias, and a high-quality ENIG surface finish, making it an excellent choice for industries like 5G communication, automotive electronics, and aerospace.
1. Overview of the 6-Layer Rigid PCB
This 6-layer PCB is engineered for high-speed and high-frequency designs, using M6 material for its core and IS370HR laminates for its prepreg layers. The PCB has a finished thickness of 1.0mm, with 1oz copper weight on the outer layers and resin-filled, capped vias to ensure excellent reliability.
The copper coin embedded in the center of the PCB enhances its thermal performance, making it suitable for applications requiring efficient heat dissipation. With green solder mask on both sides and white silkscreen, this PCB meets IPC-Class-2 quality standards and is rigorously tested for electrical reliability.
2. PCB Construction Details
| Parameter | Specification |
| Base Material | M6 High-Speed Material + High Tg FR-4 |
| Layer Count | 6-layer |
| Board Dimensions | 120mm x 60mm ± 0.15mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.2mm |
| Finished Thickness | 1.0mm |
| Finished Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Top/Bottom Solder Mask | Green |
| Top/Bottom Silkscreen | White |
| Copper Coin | Embedded in the center of the PCB |
| Via Type | Resin-filled and capped |
| Electrical Testing | 100% tested for quality assurance |
3. PCB Stackup and Material Properties
The 6-layer stackup combines M6 material and IS370HR laminates for enhanced electrical and thermal performance:
| Layer | Material | Thickness | Dielectric Constant (Dk) |
| Layer 1 | Copper (1oz) | 35 μm | - |
| Prepreg | R5775G (M6 Core) | 0.25mm | 3.61 |
| Layer 2 | Copper (0.5oz) | 18 μm | - |
| Prepreg | IS370HR - 1080 (64%) x 2 | 0.14mm | 3.72 |
| Layer 3 | Copper (1oz) | 35 μm | - |
| Core | IS370HR Core | 0.1mm | 4.17 |
| Layer 4 | Copper (1oz) | 35 μm | - |
| Prepreg | IS370HR - 1080 (64%) x 2 | 0.14mm | 3.72 |
| Layer 5 | Copper (0.5oz) | 18 μm | - |
| Core | IS370HR Core | 0.1mm | 4.17 |
| Layer 6 | Copper (1oz) | 35 μm | - |
Key Material Properties
M6 High-Speed Material
IS370HR Material
4. Applications of the 6-Layer Rigid PCB
Millimeter-wave antennas and RF front-ends for Active Antenna Units (AAU).
Advanced Driver Assistance Systems (ADAS) and 77GHz millimeter-wave radar systems.
Routers, switches, and other high-speed networking equipment.
Radar systems, avionics, and satellite communication devices.
The combination of M6 material, copper coin embedding, and resin-filled vias ensures this PCB meets the demands of cutting-edge applications with superior thermal and electrical performance.
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs tailored to your specific requirements. Our 6-layer rigid PCB with M6 high-speed material and High Tg FR-4 is designed to meet the challenges of modern high-frequency designs.
If you have any technical questions or need assistance, feel free to contact me at sales30@bichengpcb.com. I look forward to helping you bring your ideas to life!
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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