Fabricate Hybrid Multilayer PCB on RO4003C and S1000-2M 6-layer 1.1mm Thick used

Product Specification

Introduction of RO4003C:
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/glass. This unique combination aims to offer superior high-frequency performance and low-cost circuit fabrication. The material is designed to address the needs of designers working on RF microwave circuits, matching networks, and controlled impedance transmission lines, providing a low-loss solution that can be fabricated using standard epoxy/glass (FR-4) processes at competitive prices.

Features of RO4003C:

• Dielectric Constant of DK 3.38 +/- 0.05 at 10GHz
• Dissipation Factor of 0.0027 at 10GHz
• Thermal Conductivity of 0.71 W/m/°K
• Thermal Coefficient of Dielectric Constant at +40 ppm/°C, ranging from -50°C to 150°C
• CTE matched to copper with X-axis of 11ppm/°C, Y-axis of 14ppm/°C
• Low Z-axis coefficient of thermal expansion at 46 ppm/°C
• Tg > 280 °C
• Low Moisture Absorption of 0.06%

Features (S1000-2M)

• -Lower Z-Axis CTE for improved throughhole reliability
• -Excellent Mechanical Processability andThermal Resistance
• -Leadfree Compatible
• -Tg180℃ (DSC), UV Blocking/AOI compatible
• -High heat resistance
• -Excellent Anti-CAF performance
• -Low water absorption

PCB Stackup:
Describes the layer configuration of a 6-layer rigid PCB using RO4003C and S1000-2M materials, specifying the copper layer thickness, core material, prepreg thickness, and copper foil weight for each layer. The stackup ensures precise impedance control, thermal management, and mechanical stability for high-performance circuit designs.

6-layer rigid PCB
Copper_layer_1 - 35 μm
RO4003C - 0.305 mm (12mil)
Copper_layer_2 - 35 μm
Prepreg - 1080 RC63% 0.0644mm (2.5mil)
Copper_layer_3 - 35 μm
S1000-2M - 0.203 mm (3mil)
Copper_layer_4 - 35 μm
Prepreg - 1080 RC63% 0.0644mm (2.5mil)
Copper_layer_3 - 35 μm
RO4003C - 0.305 mm (12mil)
Copper_layer_4 - 35 μm

PCB Construction Details:
Provides specific information on the board dimensions, trace/space requirements, hole size, via plating thickness, surface finish, solder mask color, impedance control specifications, and quality testing procedures for the PCB. Details such as component count, pad count, via count, and nets provide an overview of the board's complexity and functionality.

PCB Statistics:
Summarizes the key statistics of the PCB, including the number of components, total pads, through-hole pads, top and bottom surface mount technology (SMT) pads, vias, and nets. These statistics offer insights into the PCB's design complexity and interconnectivity.

Type of Artwork Supplied:
Specifies the file format (Gerber RS-274-X) for the PCB artwork, ensuring compatibility with manufacturing processes and design software.

Accepted Standard:
Indicates compliance with IPC-Class-2 standards, reflecting the quality and reliability of the PCB manufacturing process.

Availability:
Highlights the global availability of the RO4003C material, ensuring accessibility for designers and manufacturers worldwide.

Typical Applications:
Lists various applications where RO4003C is commonly used, such as commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave systems, radar technology, guidance systems, and point-to-point digital radio antennas. These examples showcase the versatility and performance of the material across different industries.