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China factory - Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

  • China,Zhengzhou ,Henan
  • Active Member

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China Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency
China Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

  1. China Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency
  2. China Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency
  3. China Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

  1. MOQ: 1
  2. Price: Price negotiable
  3. Get Latest Price
Payment Terms T/T
Supply Ability 300/pcs per month
Delivery Time 2-3weeks
Packaging Details Carton Box
using Back grinding machines, dicing saws
flatness high
parallelism depth
dress easy to dress
size 2, 3, 4, 5, 6, 8 and 12 inch
Feature Durable
planarity 0.005
fit for Strasbaugh
Brand Name HT
Model Number HT-CT
Certification ISO9001:2015
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 300/pcs per month
Delivery Time 2-3weeks Packaging Details Carton Box
using Back grinding machines, dicing saws flatness high
parallelism depth dress easy to dress
size 2, 3, 4, 5, 6, 8 and 12 inch Feature Durable
planarity 0.005 fit for Strasbaugh
Brand Name HT Model Number HT-CT
Certification ISO9001:2015 Place of Origin China
High Light vacuum chuck tableporous ceramic vacuum chuck

Wafer Back table for silicon Grinding Machines Porous Chuck Table High planarity 12 Inch fit for Strasbaugh

 

Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.

 

 

Features:

 

1 This wafer chuck provides a high flatness and depth of parallelism.
2 It is compact in structure, uniform size and high strength.
3 It features a well-distributed absorption capacity.
4 The dicing accessory is easy to dress.

 

Applications

 

2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers back grinding

 

Applicable Machines

 

Back grinding machines, dicing saws

 

Type

 

Ceramic,Metal

 

 

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Importer,Exporter,Seller

  • Year Established:

    1997

  • Total Annual:

    5000000-10000000

  • Employee Number:

    400~500

  • Ecer Certification:

    Active Member

  Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones a...   Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones a...

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Get in touch with us

  • Reach Us
  • Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
  • 176#, The 7th Street, Economic & Technological Development Area. 450016, Zhengzhou, China
  • https://www.diamondhoningtool.com/

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