Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | Rogers |
| Layer | 4 |
| Color | Bare Copper |
| Min line space | 5mil |
| Min line width | 5mil |
| Copper thickness | 1OZ |
| Board size | 189*49mm |
| Panel | 1 |
| Surface | ENIG |
| Other | Impedance Control |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | Rogers | Layer | 4 |
| Color | Bare Copper | Min line space | 5mil |
| Min line width | 5mil | Copper thickness | 1OZ |
| Board size | 189*49mm | Panel | 1 |
| Surface | ENIG | Other | Impedance Control |
| Brand Name | XCE | Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL | Place of Origin | China |
| High Light | Pcb Board Prototype ，Pcb Design And Fabrication | ||
Rogers 3003 HDI Pcb , Rf Electronics Multilayer Printed Circuit Board 1.5mm Thickness
Key Specifications/Special Features:
Specification:
Board material: rogers 3003
Layer count: 4L
Board thickness: 1.5mm
Min hole size: 0.1mm
Min track width/space: 0.2mm/0.2mm
Copper thickness: 1oz
Solder mask: black/blue/green
Silkscreen: white
Surface finishing: Immersion Gold
Testing procedures for PCB board:
We perform multiple quality assuring procedures
before shipping out any PCB board. These include:
Visual Inspection
Flying probe
Impedance control
Solder ability detection
Digital metallogenic microscope
AOI (Automated Optical Inspection)
Quotation requirement:
Following specifications are needed for quotation:
Quantity
Base material
Board thickness
Copper thickness
Surface treatment
Color of solder mask and silkscreen
Shipping method and payment terms:
By DHL, UPS, FedEx, TNT using clients account.
DHL, UPS, FedEx, TNT forwarder of China.
We could ship the parcel by Russia Special Air Line for Russian customer
(No tax in your there, 3 - 10 days to Moscow , 15-20 days to other city)
By sea or air for mass quantity according to customer's requirement.
By customer's Forwarder
Payment by PayPal, T/T, Western Union, and more.
Parameter:
o Item Data
1 Layer: 1 to 24 layers
2 Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness:0.20mm to 3.4mm
4 Copper thickness:0.5 OZ to 4 OZ
5 Copper thickness in hole:>25.0 um (>1mil)
6 Max. Board Size:(580mm×1200mm)
7 Min. Drilled Hole Size:4mil(0.1mm)
8 Min. Line Width:3mil (0.075mm)
9 Min. Line Spacing:3mil (0.075mm)
10 Surface finishing:HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:±0.13
13 Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14 Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate:UL,SGS,ISO 9001:2008
16 Special requirements:Buried and blind vias+controlled impedance +BGA
17 Profiling:Punching, Routing, V-CUT, Beveling
Applications:
Amplifier Combiner Coupler Mixer Multiplexer Power divider WiFi
WiMAX, LTE bands 3G and 4G antenna
Typical Applications:
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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