Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 |
| Layer | 6 |
| Color | Green |
| Min line space | 4mil |
| Min line width | 4mil |
| Copper thickness | 1OZ |
| Board size | 175*66MM |
| Panel | 1 |
| Surface | Immersion Gold |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 | Layer | 6 |
| Color | Green | Min line space | 4mil |
| Min line width | 4mil | Copper thickness | 1OZ |
| Board size | 175*66MM | Panel | 1 |
| Surface | Immersion Gold | Brand Name | XCE |
| Model Number | XCEM | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | pcb manufacturing process ，fr4 circuit board | ||
6-Layer HDI Multilayer PCB, Immersion Gold Surface Finishes Board
We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.
F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material
FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.
Features:
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
PCB Manufacturing Capabilities
Smallest drill size of 0.1mm (~4mil)
1 to 36 layers
FR4, Rogers, Taconic,Arlon,F4B
PCB Fabrication thickness starting at 8mil for Rigid and 0.2mm for Flex.
0.4 ounce to 4 ounce copper
Minimum Trace / Space of 3mil.
Finishes include; immersion Gold, Silver, Tin, Lead free HASL and OSP.
Board finish colors; Green, Blue, Black, Yellow, Red, White.
Parameter:
| Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 |
| Copper thickness | 1-6OZ | |||||
| Min.Hole size | 0.1mm | |||||
| Min.Line Width | 0.1mm | |||||
| Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
| Solder masker color | green,red,black,white,yellow | |||||
| Silkscreen color | black,white,yellow | |||||
| Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
|||||
| Special requirements | Buried and blind vias+controlled impedance +BGA | |||||
| Total Pad Size | Standard | Advanced |
| Capture Pad | Drill + 0.008 | Drill + 0.006 |
| Landing Pad | Drill + 0.008 | Drill + 0.006 |
| BC Mechanical Drill (Type III) | 0.008 | 0.006 |
| Laser Drill Size | 0.004-0.010 | 0.0025 |
| Material Thickness | 0.0035 | 0.0025 |
| Stacked Via | Yes | Yes |
| Type I Capabilities single & Double Deep | Yes | Yes |
| Type II Capabilities Buried Vias with Microvias | Yes | Yes |
| Type III Capabilities | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| Smallest Copper Filled Microvia | 0.004 | 0.0025 |
| Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
| Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
| Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:01 |
| Layers | 1-16 layers | Min Board Thickness(2-layer) | 0.2mm |
| Max Board Size | 635 × 1100mm | Min Board Thickness(4-layer) | 0.6mm |
| Min Board Size | 20 × 30mm | Min Inner-layer Thickness | 0.1mm |
| Min Trace | 0.1mm | Min Annular Ring | 0.1mm |
| Min Space | 0.1mm | Min Hole Location Tolerance | ±0.075mm |
| Min Hole Size | 0.2mm | Min Hole Size Tolerance | ±0.05mm |
| Board Warp | ≤ 1° | Min Outer Dimension Tolerance | ±0.1mm |
| Solder Mask | Green, Yellow, Red, Black, Blue, White | ||
| Surface Finish | HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP | ||
| Board Material | FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic | ||
| Acceptable file | Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD | ||
| CAM software | Genesis, CAM350 | ||
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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