BGA FR4 PCB Multilayer / Immersion Gold PCB Board Programmable

Product Specification

BGA FR4 PCB Multilayer Board Woth Immersion Gold PCB Board Programmable Pcb Board

Quick detail:

The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)

Yellow and white core plate divided core material, usually white core material;

Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";

Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;

Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;

TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)

CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);

Dielectric constant (Er): general value 4.2-4.5;

Thermal decomposition temperature (TD): typ. 305 ℃;

Model Number:XCEPCB005

Shipping port:ShenZhen/HongKong

Place of origin:GuangDong,China

Delivery Time:3-10 Working Days

Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union

Certification:CE,ROHS,FCC,ISO9008,SGS,UL

The full name of Ball BGA Grid Array (BGA package), which is produced at the bottom of the ball array package substrate as the circuit I / O terminals and the printed circuit board (PCB) interconnected. Devices using the technology package is a surface mount device.

BGA package (Ball Grid Array Package) of I / O terminals are round or columnar pad matrix form distributed in the following packaging advantages of BGA technology is the I / O pin count, although increased, but did not pitch Save small but increased, thereby improving the assembly yield; although it increases the power consumption, but can be controlled collapse chip BGA welding method, which can improve its electric properties; thickness and weight than prior art encapsulation decreased ; reduce parasitics, the signal propagation delay is small, the frequency of use greatly increased; coplanar welding assembly is available, and high reliability.

Parameter:

Features

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

Rogers material in stock: