China factories

China factory - Shenzhen Xinchenger Electronic Co.,Ltd

Shenzhen Xinchenger Electronic Co.,Ltd

  • China,Shenzhen ,Guangdong
  • Site Member

Leave a Message

we will call you back quickly!

Submit Requirement
China High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb
China High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb

  1. China High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb

High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb

  1. MOQ: MOQ 1 Piece
  2. Price: Negotiation
  3. Get Latest Price
Payment Terms T/T, Western Union
Supply Ability 1000000 pieces per week
Delivery Time 5-10 working days
Packaging Details 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color Blue
Material F4B Material
Layer 4
Board Size 12*5cm
Copper Thinknes 1 oz
Min Line Width 4 mil
Min Line Space 4mil
Surface Finish ENIG
Name F4B pcb
Brand Name XCE
Model Number XCE BT66
Certification CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin China

View Detail Information

Contact Now Ask for best deal
Get Latest Price Request a quote
  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T, Western Union Supply Ability 1000000 pieces per week
Delivery Time 5-10 working days Packaging Details 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color Blue Material F4B Material
Layer 4 Board Size 12*5cm
Copper Thinknes 1 oz Min Line Width 4 mil
Min Line Space 4mil Surface Finish ENIG
Name F4B pcb Brand Name XCE
Model Number XCE BT66 Certification CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin China
High Light electronic pcb boardlead free pcb

High Frequency Microwave RF PCB F4B ER = 2.2 Permittivity 4 Layer Pcb

 

Quick Detail :

 

 

Type Pcb
Material F4B
Layer Multilayer
Size 12*5cm
Permittivity 2.2
Color Green
Surface Finish ENIG


 
 


Features:

 

RO3035™ high frequency circuit materials are ceramic- fi lled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3000® series laminates are ceramic-fi lled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.

 

Parameter:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2

 

 
Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 
 
Data : 

Layer 1 to 28 layers
Material type FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness 0.21mm to 7.0mm
Copper thickness 0.5 OZ to 7.0 OZ
Copper thickness in hole >25.0 um (>1mil)

 

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

 

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

 

Tolerance

 

Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate UL, ISO 9001, ISO 14001
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

 

 

 

 

Benefits:

  • Laminates can be used in applications up to 30-40GHz
  • Reliable stripline and mulilayer boards constructions
  • Ideal for multilayer board designs with a range of dielectric constants
  • Suitable for use with epoxy glass multilayer board hybrid designs
  • Ideal for applications sensitive to temperature change
  • Lower operating termperature and increase reliability in power amplifier applications

 

Typical Applications:

  • band pass filters
  • microstrip patch antennas
  • voltage controlled oscillators

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s

 
 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
 
Detailed Images :
  
 
 
 
 
 
 

 

 

 

 

 

 


 
 
Payment Term :
 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2002

  • Total Annual:

    1000000-2000000

  • Employee Number:

    100~200

  • Ecer Certification:

    Site Member

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.   We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.   We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen Xinchenger Electronic Co.,Ltd
  • Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
  • https://www.fr4-pcb.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement