Infrared Picosecond Dual-Platform Laser Cutting equipment for Sapphire / Quartz

Abstract

Infrared Picosecond Dual-Platform Laser Cutting System for Sapphire/Quartz/Optical Glass Processing

The infrared picosecond dual-platform glass laser cutting system is a high-end precision machining solution based on ultrafast laser technology. It utilizes a 1064nm infrared picosecond laser (pulse width 1-10ps) combined with a dual-station platform design, specifically engineered for precision processing of high-hardness brittle materials including sapphire, quartz glass, and optical glass.

Through a "cold processing" mechanism based on multiphoton absorption, the system achieves high-quality cutting with a heat-affected zone <1μm and surface roughness Ra<0.5μm, while maintaining ±2μm machining accuracy and 10μm minimum feature size capability. The dual-platform configuration enables alternating loading/unloading operations, improving processing efficiency by over 30% with cutting speeds reaching 100-500mm/s - making it particularly suitable for mass production of premium components like smartwatch covers, optical lenses, and semiconductor wafers.

Main parameter

Working Principle

1. Ultrafast Laser Interaction Mechanism
Utilizing picosecond-level ultra-short pulse lasers (10^-12 second level) with extremely high peak power density (GW/cm² level) to instantaneously plasmaize materials, achieving atomic-level material removal.

2. Nonlinear Absorption Effect
Laser energy is captured by materials through multiphoton absorption processes, overcoming traditional linear absorption limitations to enable effective processing of transparent materials.

3. Dual-Station Collaborative Operation
Two independent processing platforms achieve parallel machining and loading/unloading operations through an intelligent scheduling system, maximizing equipment utilization efficiency.

Advantages

1. High degree of overall automation (cutting and breaking can be integrated), low power consumption, and simple operation.

2. The non-contact nature of laser processing enables techniques unachievable by traditional methods.

3. Consumable-free processing with lower operational costs and enhanced environmental friendliness.

4. High precision, zero taper, and no secondary damage to workpieces.

Process Applications

Suitable for precision cutting of various hard and brittle materials, including:

· Contour machining of standard/optical glass

· Cutting of ultra-hard materials (quartz, sapphire)

· Profile processing of tempered glass, filters, and mirrors

· Precise internal hole extraction

Processing Advantages

· Dual-platform integrated cutting/breaking with flexible switching;

· High-speed processing of complex profiles (30%+ efficiency improvement);

· Taper-free cuts with smooth, burr-free edges;

· Fully automatic model changeover with intuitive operation;

· Zero consumables, pollution-free (50% lower operating costs);

· No machining waste generation, ensuring surface integrity;

Machining effect——Sample display