Horizontal Wafer Pod 4"5"6"8"12" PP Material Wafer Transporter With Foam Cushion

Product Specification

Horizontal Wafer Pod – 4"/5"/6"/8"/12" PP Wafer Transporter with Foam Cushion

The Horizontal Wafer Pod series represents a significant advancement in the safe and secure transport of semiconductor wafers, specifically designed to address the rigorous requirements of R&D and small-batch production environments. These pods are meticulously engineered to accommodate wafer sizes from 4 inches to 12 inches, utilizing medical-grade polypropylene (PP) combined with a custom-engineered, multi-layer foam cushion system for maximum protection.

This triple-layer protective approach ensures unparalleled safety, safeguarding wafers against:

✔ Mechanical shocks: Absorption capacity of up to 50G impacts, protecting delicate structures during handling and transport.

✔ Particle contamination: Maintains a class-leading cleanliness level with <5 adders @ 0.3μm, significantly reducing the risk of contamination in critical processes.

✔ Electrostatic discharge (ESD): Provides reliable static dissipation with a surface resistivity of 10⁶–10⁹Ω, fully compliant with ESD control standards.

Ideal for cleanroom-to-cleanroom transfers and long-term wafer storage, these wafer pods deliver SEMI E1.9 compliance, ensuring compatibility across global semiconductor facilities. Designed for repeated use, each pod has been tested to maintain consistent performance for 500+ operational cycles without any degradation, resulting in exceptional long-term cost-effectiveness.

The innovative color-coded foam insert system streamlines wafer size identification and minimizes the chance of misloading, supporting operational efficiency and accuracy in fast-paced lab and fab environments.

Key Features & Innovations

Advanced Protective Structure

• 3D-molded PE foam cushions offer tailored support for each wafer, cradling them with uniform pressure distribution.

• ​Multi-stage shock absorption system:

• Outer shell: 3mm thick, crush-resistant PP housing absorbs initial impact.

• Middle layers: Gradient-density foam layers distribute shock forces progressively, reducing transmission to the wafer.

• Inner lining: Anti-static fleece layer prevents micro-scratches and adds an extra barrier against particulate generation.

Intelligent Wafer Management

• Laser-etched capacity markers on each pod ensure clear inventory management and capacity tracking.

• ​​Stackable design with precision alignment pins prevents lateral movement, allowing secure and space-efficient storage.

Cleanroom-Optimized Design

• Seamless one-piece construction eliminates joints and gaps, reducing potential particle traps and simplifying cleaning protocols.

Custom Configuration Options

• Wafer size variants: From 4" to 12" (including 150mm, 200mm, and 300mm formats).

• Foam types: Conductive, fire-retardant, or low-outgassing, tailored to specific process and regulatory needs.

• Special versions: Options include vacuum-compatible models for high-vacuum environments and high-humidity versions for challenging storage conditions.

Technical Specifications

Applications

Research & Development

• University and corporate labs: Secure transfers between cleanroom modules.

• Process development: Reliable wafer storage for prototype and pilot processes.

• Material characterization: Protecting vibration-sensitive samples during transit.

Small-Batch Production

• MEMS fabrication: Safe handling of fragile MEMS structures.

• Optoelectronics: Protection for GaAs and GaN wafers in optoelectronic applications.

• Solar cell R&D: Secure transfer of large 12" wafer substrates for experimental solar devices.

Equipment Maintenance & Calibration

• Tool qualification: Robust storage for golden and reference wafers.

• Metrology: Calibration wafer protection during transport.

• Controlled environments: Transport of moisture-sensitive or hygroscopic devices.

Supply Chain Logistics

• Fab-to-fab transfers: Certified for rugged handling (MIL-STD-810G compliance).

• International shipments: IATA dangerous goods certification ensures safe global transport.

• Long-term archival: Proven 10-year material stability for archived wafer lots.

Q&A

Q1: What makes your foam cushion system superior to standard polyethylene foam?
A1: Our proprietary triple-layer foam system offers:

• Top layer: Ultra-fine 0.2 mm pore size, delivering 99.9% particle filtration for cleanroom safety.

• Middle layer: Viscoelastic memory foam with 30% rebound rate, providing both shock absorption and shape recovery for extended use.

• Base layer: Conductive carbon-infused foam with <100 Ω/sq surface resistance to ensure rapid electrostatic dissipation.

Q2: How do you ensure ESD protection during wafer transfers?
A2: Our pods integrate:

• Surface resistivity of 10⁶–10⁹Ω, meeting ANSI/ESD S20.20 guidelines.

• Continuous grounding path via integrated handle contacts for real-time charge neutralization.

• Optional IoT ESD sensors for live monitoring and data-driven ESD risk management.