SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months |
| Laser Type | Excimer (193nm/248nm), Femtosecond (343nm/1030nm) |
| Processing Area | Max 150mm × 150mm |
| Processing Speed | 50–300mm/s |
| Lift-Off Thickness | 10nm–20μm |
| System Integration | EFU clean unit, exhaust gas treatment system |
| Application | Semiconductor Manufacturing,Flexible Electronics |
| Brand Name | ZMSH |
| Model Number | Laser Separation System Machine |
| Certification | rohs |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months | Laser Type | Excimer (193nm/248nm), Femtosecond (343nm/1030nm) |
| Processing Area | Max 150mm × 150mm | Processing Speed | 50–300mm/s |
| Lift-Off Thickness | 10nm–20μm | System Integration | EFU clean unit, exhaust gas treatment system |
| Application | Semiconductor Manufacturing,Flexible Electronics | Brand Name | ZMSH |
| Model Number | Laser Separation System Machine | Certification | rohs |
| Place of Origin | CHINA | ||
| High Light | SiC Substrate Laser Separation Machine ，Customized SiC Substrate Laser Separation Machine | ||
6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized
The Laser Lift-Off (LLO) System is an advanced precision processing technology that utilizes high-energy pulsed lasers to achieve selective material separation at interfaces. This technology is widely applied in semiconductor manufacturing, flexible electronics, optoelectronic devices, and energy sectors. Its core advantages include non-contact processing, high-resolution control, and multi-material compatibility, making it indispensable for applications such as MicroLED mass transfer, flexible display fabrication, and semiconductor wafer-level packaging.
Company Service Highlights:
Customized Solutions: Tailored laser wavelength (193nm–1064nm), power (1W–100W), and automation integration to support R&D and mass production.
Process Development: Laser parameter optimization, beam shaping design, and validation services (e.g., UV laser LLO for sapphire substrates).
Smart Maintenance: Integrated remote monitoring and fault diagnosis, ensuring 24/7 operational support with <2-hour response time.
| Parameter | Typical Values | Notes |
| Laser Type | Excimer (193nm/248nm), Femtosecond (343nm/1030nm) | Pulse width 5–20ns, peak power >10kW |
| Processing Area | Max 150mm × 150mm | Multi-station parallel processing |
| Processing Speed | 50–300mm/s | Adjustable per material and laser power |
| Lift-Off Thickness | 10nm–20μm | Layer-by-layer delamination capability |
| System Integration | EFU clean unit, exhaust gas treatment system | ISO 14644 cleanliness compliance |
LLO operates through selective ablation at material interfaces:
Laser Irradiation: High-energy pulses (e.g., excimer or femtosecond lasers) focus on the target interface (e.g., sapphire-GaN), inducing photothermal/photochemical reactions.
Interface Decomposition: Laser energy triggers gasification (e.g., GaN → Ga + N₂), generating plasma and thermal stress for controlled delamination.
Material Collection: Delaminated microstructures are captured via vacuum suction or fluid dynamics, ensuring contamination-free transfer.
Key Technologies:
| Feature | Technical Specifications | Applications |
| Non-contact Processing | Laser energy transmitted via optics, avoiding mechanical stress on fragile materials | Flexible OLED, MEMS |
| High Precision | Positioning accuracy ±0.02mm, energy density control ±1% | MicroLED transfer, sub-μm patterning |
| Multi-material Compatibility | Supports UV (CO₂), visible (green), and IR lasers; compatible with metals, ceramics, polymers | Semiconductors, medical devices, renewables |
| Intelligent Control | Integrated machine vision, AI-driven parameter optimization, automated loading/unloading | 30%+ production efficiency improvement |
1. Semiconductor Manufacturing
2. Flexible Electronics
3. Medical Devices
4. Renewables
1. Q: What is a laser lift-off system?
A: A laser lift-off system is a precision processing tool that uses high-energy pulsed lasers to selectively separate materials at interfaces, enabling applications like MicroLED mass transfer and flexible electronics manufacturing .
2. Q: What industries use LLO systems?
A: LLO systems are critical in semiconductor manufacturing (wafer-level packaging), flexible electronics (foldable displays), medical devices (sensor fabrication), and renewables (solar cells), offering non-contact, high-resolution processing .
Tags: #6-12 Inch, #1064nm, # SiC Substrate Laser Separation System Machine, #Wafers Customized
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...
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