SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months |
| Packaging Details | package in 100-grade cleaning room |
| Project | single/multiple wire saw |
| Diamond wire diameter | 0.2-0.37mm |
| Cutting thickness range | 1.5-80mm |
| Cutting accuracy | 0.01mm |
| Cutting method | The workbench swings upwards, but the position of the diamond wire remains unchanged |
| Cutting feed speed | 0.01-10mm/min |
| Workstation | 2 |
| Brand Name | ZMSH |
| Model Number | Diamond Wire Single/Multiple Wire Saw machine |
| Certification | rohs |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000pcs per month |
| Delivery Time | 3-6 months | Packaging Details | package in 100-grade cleaning room |
| Project | single/multiple wire saw | Diamond wire diameter | 0.2-0.37mm |
| Cutting thickness range | 1.5-80mm | Cutting accuracy | 0.01mm |
| Cutting method | The workbench swings upwards, but the position of the diamond wire remains unchanged | Cutting feed speed | 0.01-10mm/min |
| Workstation | 2 | Brand Name | ZMSH |
| Model Number | Diamond Wire Single/Multiple Wire Saw machine | Certification | rohs |
| Place of Origin | CHINA | ||
| High Light | Semiconductor Wafer Processing Machine ，Multiple Wire Saw Machine ，Diamond Wire Saw Machine | ||
Diamond Wire Single/Multiple Wire Saw Machine For Semiconductor Wafer Processing
The diamond wire single/multi-wire dual-station cutting machine is a high-end precision equipment specifically developed for processing hard and brittle materials. Utilizing electroplated diamond wire technology and equipped with dual independent workstations, it enables flexible switching between single-wire precision processing and multi-wire batch production modes. The system integrates high-precision motion control, intelligent tension systems, and adaptive cooling technology, making it ideal for precision cutting applications involving semiconductor wafers, photovoltaic silicon wafers, and optical components.
| Parameter | Specification |
| Project | Single/multiple wire saw |
| Maximum workpiece size | ø 320*430mm |
| Main roller coating diameter | ø 210*450mm (Five main rollers) |
| Wire running speed | 1000 (MIX) m/min |
| Diamond wire diameter | 0.2-0.37mm |
| Line storage capacity of supply wheel | 20(0.25mm) diamond wire diameter/km |
| Cutting thickness range | 1.5-80mm |
| Cutting accuracy | 0.01mm |
| Vertical lifting stroke of workstation | 350mm |
| Cutting method | The workbench swings upwards, but the position of the diamond wire remains unchanged |
| Cutting feed speed | 0.01-10mm/min |
| Water tank | 300L |
| Cutting fluid | Anti-rust high-efficiency cutting fluid |
| Swing angle | ±8° |
| Swing speed | 0.83°/s |
| Maximum cutting tension | 100N (Set minimum unit 0.1N) |
| Cutting depth | 430mm |
| Workstation | 2 |
| Power supply | Three-phase five-wire AC380V/50Hz |
| Total power of machine tool | ≤52kW |
| Main motor | 7.5*3kW |
| Wiring motor | 0.75*2kW |
| Workbench swing motor | 1.3*2kW |
| Tension control motor | 4.4*2kW |
| Wire release and collection motor | 5.5*2kW |
| External dimensions (excluding rocker arm box) | 2310*2660*2893mm |
| External dimensions (including rocker arm box) | 2310*2660*2893mm |
| Machine weight | 6000kg |
1. Cutting System:
2. Dual-Station Coordination:
3. Control System:
1. High-Precision Processing Capability:
2. Flexible Production Modes:
3. Intelligent Control System:
4. Robust and Durable Design:
1. Semiconductor Wafer Manufacturing:
2. Photovoltaic Production:
3. Optical Component Processing:
4. Special Material Processing:
5. Research & Special Applications:
Technical advantages of diamond wire single/multiple wire saw machine
Note: Custom solutions available including special dimension processing and cleanroom versions.
1. Q: What is the main advantage of a dual-station diamond wire saw?
A: It enables simultaneous high-precision single-wire cutting and multi-wire batch processing, boosting productivity by 50% compared to single-mode machines.
2. Q: Which materials can be cut with diamond wire dual-station saws?
A: Hard/brittle materials like silicon, SiC, GaN, sapphire, quartz, and ceramics with precision up to ±0.01mm.
Tags: #Diamond Wire Single/Multiple Wire Saw Machine, #Semiconductor Wafer Processing
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...
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