4 Layer BT core memory substrate production

Product Specification

Description Of IC Substrate pcb

IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of electronic packaging technology innovation, with high density, high precision, high performance, miniaturization and thin and other excellent characteristics. The complete chip is composed of bare chip (wafer) and packaging body (packaging substrate and sealing material, lead, etc.).Packaging substrate as the core of the chip packaging material, on the one hand can protect, fixed, supporting chip, chip heat conduction heat dissipation performance, guarantee the chip is not subject to physical damage, on the other hand are connected to the chip package substrate of the upper, lower and printed circuit board is linked together, to achieve the electrical and physical connection, power distribution, signal, and the internal and external communication chip circuit, etc.

Application:

• ​DDR
• NAND memory devices
• Flash memory electronics
• Smart electronics;
• Sd card / memory card

Spec.of pcb production:

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

FAQ:

1. Where's HOREXS company location ?

HOREXS group has two factories,Old factory located in huizhou city Guangdong,Another one is located in Hubei provice.

1. Does HOREXS have MOQ/ MOV ?

HOREXS no set any MOQ / MOV for any clients now.

1. Can HOREXS produce big volume ic substrate ?

Yes,We can,Our old factory capacity is 15000sqm/month,New factory is 50000sqm/Month.

1. What we should contact If we are seeking cooperation with HOREXS ?

Contact person:AKEN,email ID: akenzhang@horexspcb.com,Support roadmap/Design rules files,Production capability files.

1. Does HOREXS support IC package / IC design service ?

No,We dont have it,We are only semiconductor ic substrate manufacture,But we can let our clients to help.

1. What does HOREXS need when we need quotation ?

• Gerber files;
• Production specifications;
• If multilayer pcb substrate,Also need buildup/stackup information;
• Others good for quotation files;

1. Can HOREXS produce FCBGA package substrate now ?

No,From HOREXS roadmap ,HOREXS will start FCBGA substrate manufacture in 2024 or 2025.

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Shipping:

• DHL / UPS / Fedex;
• By air / By sea;
• Customize Express (Own account of DHL / UPS/ Fedex)