HUATAO LOVER LTD
| Payment Terms | L/C, T/T, Western Union, MoneyGram |
| Supply Ability | 500000 KM/Month |
| Delivery Time | 7-10 Days |
| Packaging Details | Wooden Box / Standard Export Package |
| Product Name | Ultra-Thin Diamond Wire |
| Core Wire Dia | 35 Um |
| Girt Quantity | 120-220 PC/mm |
| Surface Roughness | Ra ≤0.2μm |
| Diamond Grit | 1.5–3μm monocrystalline |
| Kerf | 65μm |
| Brand Name | HUATAO |
| Model Number | Ultra-Thin Diamond Wire |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | L/C, T/T, Western Union, MoneyGram | Supply Ability | 500000 KM/Month |
| Delivery Time | 7-10 Days | Packaging Details | Wooden Box / Standard Export Package |
| Product Name | Ultra-Thin Diamond Wire | Core Wire Dia | 35 Um |
| Girt Quantity | 120-220 PC/mm | Surface Roughness | Ra ≤0.2μm |
| Diamond Grit | 1.5–3μm monocrystalline | Kerf | 65μm |
| Brand Name | HUATAO | Model Number | Ultra-Thin Diamond Wire |
| Place of Origin | CHINA | ||
| High Light | Precision Diamond Wire ，Ultra Thin Diamond Wire ，Semiconductor Diamond Wire | ||
Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing
Description For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:
Precision ultra-thin diamond wire is a cutting-edge cutting tool used in the semiconductor and photovoltaic (PV) industries for slicing silicon wafers with exceptional accuracy and minimal material loss. It consists of a high-tensile core wire (typically steel or tungsten) electroplated with diamond abrasive particles, enabling ultra-thin, high-efficiency slicing of monocrystalline and polycrystalline silicon ingots.
Features For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:
1. Ultra-Thin Diameter: Ranges from 30–100 μm, enabling minimal kerf loss and higher wafer yield.
2. High Precision Cutting: Ensures uniform wafer thickness (as low as 100–200 μm) with superior surface quality.
3. Diamond Abrasives: Synthetic diamond particles (5–30 μm) provide exceptional hardness and wear resistance.
4. High Tensile Core: Steel or tungsten wire ensures durability and breakage resistance during high-speed cutting.
5. Low Wire Vibration: Enhances cutting stability, reducing wafer surface defects like micro-cracks.
Applications For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:
1. Semiconductor Industry: Slicing silicon ingots into ultra-thin wafers for ICs, MEMS, and power devices. Enables thinner wafers for advanced packaging (e.g., 3D ICs).
2. Photovoltaic (PV) Solar Cells:Cutting monocrystalline and polycrystalline silicon ingots into wafers for high-efficiency solar panels. Reduces silicon waste, lowering production costs.
3. Advanced Materials Processing: Used for slicing brittle materials like sapphire, SiC, and glass.
Advantages For Precision Ultra-Thin Diamond Wire For Semiconductor & PV Silicon Wafer Slicing:
1. Higher Efficiency: Faster cutting speeds (up to 1.5–2.5 m/s) compared to slurry-based multi-wire sawing.
2. Lower Material Waste: Kerf loss reduced to ~100 μm (vs. 150–200 μm with slurry saws).
3. Eco-Friendly: Eliminates slurry waste, reducing environmental impact.
Cost-Effective: Longer wire lifespan and higher productivity lower overall manufacturing costs.
Company Details
Business Type:
Manufacturer,Exporter,Trading Company
Year Established:
2001
Total Annual:
50000000-80000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
HUATAO LOVER LTD was born in 2001, always with the philosophy of "respecting the heaven and loving the people, striving for perfection" as the main line of development, and continuously involved in different industries. After more than ten years of development into a group enterprise, the ... HUATAO LOVER LTD was born in 2001, always with the philosophy of "respecting the heaven and loving the people, striving for perfection" as the main line of development, and continuously involved in different industries. After more than ten years of development into a group enterprise, the ...
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