Shenzhen Xinhaisen Technology Limited
| Payment Terms | T/T |
| Supply Ability | 10000-100000PCD / week |
| Delivery Time | 5-10 work days |
| Packaging Details | PE bags and Carton |
| Material | Copper or Copper Alloy |
| Size | Customizable |
| Corrosion Resistance | Excellent |
| Application | Electronic Devices |
| Operating Temperature | -50°C to 150°C |
| Brand Name | XHS/Customize |
| Model Number | Customize |
| Certification | ISO 9001, ISO 14001, IATF 16949 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000-100000PCD / week |
| Delivery Time | 5-10 work days | Packaging Details | PE bags and Carton |
| Material | Copper or Copper Alloy | Size | Customizable |
| Corrosion Resistance | Excellent | Application | Electronic Devices |
| Operating Temperature | -50°C to 150°C | Brand Name | XHS/Customize |
| Model Number | Customize | Certification | ISO 9001, ISO 14001, IATF 16949 |
| Place of Origin | China | ||
| High Light | Copper Etching Ultra-Thin Vapor Chambers ，Ultra-Thin Vapor Chambers ，High Precision Ultra-Thin Vapor Chambers | ||
Ultra-Thin Vapor Chambers Copper Metal Etching with High Precision
Vapor Chamber Overview
Shenzhen Xinhaisen Technology Co., Ltd. specializes in manufacturing high-precision, high-performance vapor chambers (VC) through advanced photochemical etching technology. Vapor chambers are critical components in modern thermal management systems, leveraging phase-change principles (evaporation-condensation) for efficient heat dissipation. We provide tailored solutions for 5G communications, smartphones, AI servers, graphics cards, and other high-end applications.
Vapor Chamber Features
·Advanced Thermal Performance
·Ultra-Thin & Lightweight
·Custom Wick Structures
·Excellent Flatness
·Rapid Prototyping
Vapor Chamber Specification
| Parameter | Specification |
| Materials | Pure Cu, OFC, SS, metal composites |
| Overall Thickness | 0.2mm – 1.5mm |
| Tolerance | ±0.01mm |
| Surface Treatments | Ni plating, passivation, sandblasting, cleaning |
| Sealing Methods | Laser welding, brazing, diffusion bonding |
·Consumer Electronics: Smartphones, tablets, laptops, VR/AR devices.
·High-Performance Hardware: GPU heat sinks, CPU coolers, AI servers, 5G base stations.
·Industrial & Medical: Laser cooling, power modules, medical device thermal management.
·Automotive Electronics: Vehicle radar, smart cockpit chips, battery management systems (BMS).
We will package your products in this way
1. Protective layer in the covers
2. PE bag
3.Foam in box
4.Waterproof package
5.Or as your request
Get Started
Send us your drawings for:
Free quote within 2 hours
Design advice
Sample arrangement
Easy to order! Just contact us with your requirements.
Company Details
Business Type:
Manufacturer,Exporter
Year Established:
2012
Total Annual:
4000000-6000000
Employee Number:
260~300
Ecer Certification：
Verified Supplier
For over 13 years Xinhaisen has pioneered developments in photochemical etching, achieving standards admired by the industry and appreciated by a global customer base from a wide range of high-tech engineering markets. Since found in 2012, in affiliating with our customers we have pioneered many new... For over 13 years Xinhaisen has pioneered developments in photochemical etching, achieving standards admired by the industry and appreciated by a global customer base from a wide range of high-tech engineering markets. Since found in 2012, in affiliating with our customers we have pioneered many new...
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