China factories

China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

Leave a Message

we will call you back quickly!

Submit Requirement
China ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For
China ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For

  1. China ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For
  2. China ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For
  3. China ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For
  4. China ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For
  5. China ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For

ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS.PC.MPPO...etc
Color Black.Red.Yellow.Green.White..etc
Temperature General 80°C~100°C
Property ESD
Surface resistance 1.0x10E4~1.0x10E11Ω
Warpage less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning
Incoterms EXW,FOB,CIF,DDU,DDP
Brand Name Hiner-pack
Model Number 4Inch
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

View Detail Information

Contact Now Ask for best deal
Get Latest Price Request a quote
  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS.PC.MPPO...etc Color Black.Red.Yellow.Green.White..etc
Temperature General 80°C~100°C Property ESD
Surface resistance 1.0x10E4~1.0x10E11Ω Warpage less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning Incoterms EXW,FOB,CIF,DDU,DDP
Brand Name Hiner-pack Model Number 4Inch
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light ROHS Waffle Pack Chip TraysWafer Waffle Pack Chip TraysWaffle JEDEC IC Trays

ROHS Black Stable Flatness PC 2-inch and 4-inch Waffle Pack Chip Trays For Electronic Die

Need a packaging solution for tiny semiconductor devices? These anti-static waffle packs offer excellent protection and organization.


For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products, to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.


Advantages:

1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transferring or loading samples for testing
3. Stable anti-static performance, a good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, with no environmental concerns
7. It can be stackable and can also ensure the design of maximum utilization of the tray matrix

Technical Parameters:

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM TBC Customizable
Provide professional design and packaging for your products

 

Cavity Size Customized Size
Item Material ABS / PC / MPPO / PPE... acceptable
OEM&ODM YES
Item Color Can be customized
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: chosen from existing products.
B.  customized samples as per your design/demand 
MOQ 500pcs.
Packing Carton or as per the customer's request
Delivery time Usually 8-10 working days, depending on order quantity
Terms of payment Products: 100% prepayment. 
Mold: 50% T/T deposit, 50% balance after sample confirmation


Product Application:
Wafer Die / Bar / Chips / PCBA module component
Electronic component packaging and optical device packaging

 
FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product values. And all samples are shipping costs normally by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method you can use to ship the goods?
A: By sea, by air, by express, by mail post according to customer order quantity and volume.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement