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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover
China ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

  1. China ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover
  2. China ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover
  3. China ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover
  4. China ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

  1. MOQ: 1000
  2. Price: $0.28~0.55
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS~6000PCS per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Property ESD
Color Black
Material PC
Size 101.5*101.5mm
Height 4.8mm
Use Transport,Storage,Packing
HS code 39239000
Surface Resistance 1.0x10E4~1.0x10E11Ω
Brand Name Hiner-pack
Model Number HN2099 Lid
Certification ISO 9001 ROHS SGS
Place of Origin Shenzhen China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS~6000PCS per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Property ESD Color Black
Material PC Size 101.5*101.5mm
Height 4.8mm Use Transport,Storage,Packing
HS code 39239000 Surface Resistance 1.0x10E4~1.0x10E11Ω
Brand Name Hiner-pack Model Number HN2099 Lid
Certification ISO 9001 ROHS SGS Place of Origin Shenzhen China
High Light ESD Waffle Tray Packaging Lids4inch Waffle Tray Packaging LidsISO Waffle Tray Pack Lids

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

High Temperature Durable 4 Inch Black Waffle Pack Lids For IC Chip Tray Cover


The cover and insert materials are generally made of ABS or PC and industry standard anti-static Tyvek paper.

Manual placement, dislocation, and squeezing of the Tyvek paper are avoided when loading the waffle package

Seal each individual pallet pocket evenly

Compensate for normal waffle packaging cover/tray warping conditions, resulting in notching, fixed product elements do not move

Save a lot of scrap costs caused by yield loss, rework, and mold component movement.

Advantages:

1. Suitable for components or devices with daily turnover or long-distance freight;
2. Can be stacked with more layers;
3. Can be washed at high temperature;
4. Plastic waterproof, moisture-proof, improves the storage time of components;
5. No extrusion and breakage, Better protection components;
6. Reusable, quality assurance.

Application:

Wafer Dicing; Wafer Sorting; Wafer / Die Pick and place; Wafer/ Die Shipping.

Technical Parameters:

Usage Packaging of Electronic Components, Optical device
Feature ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material PC, ABS...etc
Color Black.Red.Yellow.Green.White and custom color
Size Customized size, rectangle, circle shape
Mold type Injection Mold
Design Original sample, or we can create the designs
Packing By Carton
Sample Sample time: after the draft is confirmed and payment is arranged
Sample charge: 1. Free for stock samples
                                2. Custom Tray negotiated
Lead Time 5-7 Working days
The exact time should be according to the ordered quantity

waffle pack ic chip tray cover

FAQ:

Q1: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2: What information should we supply if we want a quotation?
A: Drawing of your IC or component, Quantity, and size normally.


Q3: How long could you prepare samples?
A: Normally, 3 days. If customized, open a new mold 25~30 days around.

Q4: How about batch order production?
A: Normally 5- 7 working days or so.

Q5: Do you inspect the finished products?
A: Yes, we will inspect according to the ISO 9001 standard and be ruled by our QC staff.

 

waffle pack ic chip tray lid

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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