Place Of Origin | CHINA |
Delivery Time | 1~2 Weeks |
Payment Terms | 100% Prepayment |
Supply Ability | 2000-3000PCS/Day |
Packaging Details | Transport Packaging |
Packaging Type | Tray |
Tray Shape | Rectangular |
Customized Service | Support Standard And Non-Standard |
Mold No | HN24106 |
Dimensions | Varies Depending On IC Size |
Flatness | Less Than 0.76mm |
Brand Name | Hiner-pack |
Model Number | JEDEC TRAY SERIES |
Certification | ISO9001, SGS, ROHS |
Place of Origin | Shenzhen,China |
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Product Specification
Place Of Origin | CHINA | Delivery Time | 1~2 Weeks |
Payment Terms | 100% Prepayment | Supply Ability | 2000-3000PCS/Day |
Packaging Details | Transport Packaging | Packaging Type | Tray |
Tray Shape | Rectangular | Customized Service | Support Standard And Non-Standard |
Mold No | HN24106 | Dimensions | Varies Depending On IC Size |
Flatness | Less Than 0.76mm | Brand Name | Hiner-pack |
Model Number | JEDEC TRAY SERIES | Certification | ISO9001, SGS, ROHS |
Place of Origin | Shenzhen,China | ||
High Light | 150°C heat resistant JEDEC tray ,semiconductor transport IC tray ,high temperature JEDEC IC tray |
Our JEDEC IC Trays are high-quality trays designed specifically for the efficient and safe storage of electronic components ICs. With a heat resistance of up to 150°C, these trays are ideal for handling components that require high-temperature processing or storage.The packaging type of these trays is specifically designed as a tray, which provides a secure and organized way to store and transport electronic ICs. This tray packaging ensures that the components are protected from damage during handling and shipping, making it an essential tool for electronic component manufacturers and distributors.
Flatness | Less Than 0.76mm |
Tray Shape | Rectangular |
Reusable | Yes |
Customized Service | Support Standard And Non-Standard |
Color | Black |
IC Type | BGA, QFP, QFN, LGA, PGA |
Dimensions | Varies Depending On IC Size |
Size | 322.6*135.9*12.19mm |
Heat Resistant | High Temperature 150°C |
I. SMT Process Automation Management
Used for automated component handling in SMT assembly processes, enabling efficient and accurate counting and material management through barcode scanning for model, brand, and batch information.
II. Semiconductor Packaging and Testing
Serves as a standard storage and transportation device for chip packaging and testing, ensuring consistent product quantity and quality stability.
Product Packaging and Shipping for JEDEC IC Trays:
Our JEDEC IC Trays are carefully packaged to ensure safe delivery to our customers. Each tray is securely placed in a protective box to prevent any damage during transportation. Additionally, the trays are labeled with product information for easy identification.
For shipping, we use reliable courier services to deliver the trays to your desired location. Our packaging is designed to withstand the rigors of shipping and handling, ensuring that your JEDEC IC Trays arrive in perfect condition.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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