Shenzhen Hiner Technology Co.,LTD
| Place Of Origin | CHINA |
| Packaging Details | 80~100pcs/carton |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Color | Black, Red, Yellow, Green, White, Etc. |
| Tray Shape | Rectangular |
| Temperature | 80°C~180°C |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Service | Accept OEM, ODM |
| Property | ESD, Non-ESD |
| Molding Method | Injection Moulding |
| Reusable | Yes |
| Brand Name | Hiner-pack |
| Model Number | HN24084 |
| Certification | ISO9001, SGS, ROHS |
| Place of Origin | SHENZHEN CHINA |
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Product Specification
| Place Of Origin | CHINA | Packaging Details | 80~100pcs/carton |
| Delivery Time | 1~2 Weeks | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Color | Black, Red, Yellow, Green, White, Etc. |
| Tray Shape | Rectangular | Temperature | 80°C~180°C |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω | Service | Accept OEM, ODM |
| Property | ESD, Non-ESD | Molding Method | Injection Moulding |
| Reusable | Yes | Brand Name | Hiner-pack |
| Model Number | HN24084 | Certification | ISO9001, SGS, ROHS |
| Place of Origin | SHENZHEN CHINA | ||
| High Light | Handling ICs JEDEC Standard Tray ，Reliable JEDEC Standard Tray ，Protects ICs JEDEC Standard Tray | ||
Each tray is molded with precision to meet JEDEC outline standards—plus your custom cavity depth, width, or corner radius.
This JEDEC matrix tray is specifically designed to deliver consistent, high-reliability performance in semiconductor and electronics production settings. Crafted from durable, static-dissipative material, it provides protection for delicate components while ensuring accurate positioning during automated handling and storage tasks.
The tray's standardized design enables seamless integration with tray feeders, robotic arms, and inspection systems, enhancing operational efficiency and flexibility. Its robust construction and automation-ready structure contribute to improved process stability throughout the entire production cycle, from initial loading to final packaging.
JEDEC Standard Compatibility: Seamlessly works with industry-standard automation and handling systems across global production lines.
Permanent ESD Protection: Conductive polymer provides consistent electrostatic discharge protection for sensitive microelectronics.
Accurate Part Alignment: Uniform pocket design and defined edges help maintain component orientation and position throughout transit.
Automation-Ready Elements: Orientation markers, pickup zones, and mechanical indexing features support integration with robotic and mechanical tools.
Stable Stacking Interface: Tray edges interlock for safe and reliable vertical stacking, reducing tray movement during storage or shipment.
Operational Endurance: Built to withstand multiple handling cycles, including mechanical transfers and exposure to temperature-controlled processes.
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN24084 | Cavity Size | 8.6*8.6*2.6mm |
| Package Type | IC Component | Matrix QTY | 6*14=84PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
This tray is versatile and can be used in various applications within the electronics manufacturing industry. It is suitable for tasks such as IC packaging, test and burn-in cycles, SMT assembly, and module inspection.
The tray plays a crucial role in ensuring components are transported and stored in an organized and damage-free manner throughout different stages of the manufacturing process. Its design allows for efficient handling and storage of parts, enhancing the overall workflow efficiency.
With compatibility with vacuum-based handling systems and tray elevators, this tray is well-suited for both inline and batch workflows. It is particularly beneficial for facilities aiming to optimize efficiency and prioritize the protection of delicate components.
Flexible customization options help meet unique workflow and component requirements:
Pocket Profile Adjustment: Tailor cell depth, shape, and layout to accommodate various component sizes, shapes, and fragility levels.
Material Color Variants: Choose from multiple static-dissipative colors to simplify line control or distinguish product types.
Embedded Molded Identifiers: Integrate tracking codes, lot numbers, or branding directly into the tray mold for durable traceability.
Tool Interface Adaptations: Add edge features or locator designs to align with proprietary robotic systems or custom conveyors.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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