Semiconductor Industry Use Customizable Standard High Temperature BGA Package

Semiconductor Industry Use Customizable Standard High Temperature JEDEC Trays

Product Description:

JEDEC trays play a critical role in the handling and transportation of semiconductor devices, particularly ICs. These trays provide a safe and secure way to transport these delicate components without causing any damage. Here are some of the key features of JEDEC trays:

JEDEC trays are manufactured based on standard dimensions defined by the JEDEC organization. This standardization ensures that the trays are compatible with different manufacturers and equipment, making it easier to transport and store the devices.

Technical Parameters:

The standard structure and shape of JEDEC TRAY adhere to international standards. The tray is designed not only to carry electronic components and various packaging IC requirements but also to comply with the customer's automatic feeding system. This allows for easy loading and efficient work efficiency when matching with automation equipment.

At Hiner-Pack, we offer 100% customized JEDEC TRAY that can provide design solutions tailored to protect your IC based on the type of chip package. On our website, you can see that we have designed JEDEC TRAY to accommodate many types of packaging, including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, etc. We can provide effective design solutions and wafer-level package protection for all of your products.

Applications:

Applications of JEDEC Trays

JEDEC trays have become a popular and widely used component in various applications in the semiconductor industry. These trays are specifically designed for the safe handling, shipping, and storage of delicate electronic components, mainly integrated circuits (ICs) and other sensitive devices. The following are the three primary applications of JEDEC trays:

JEDEC trays are used in semiconductor manufacturing and assembly processes to transport and store ICs and other delicate electronic components. These trays protect the components from damage due to external factors like contamination, electrostatic discharge, and mechanical shock.

1. Semiconductor Manufacturing and Assembly
2. Testing of Electronic Components
3. Shipping and Storage of Integrated Circuits and Other Sensitive Devices

FAQ:

Q1: What is the brand name of the JEDEC Tray Series?

A1: The brand name of the JEDEC Tray Series is Hiner-pack.

Q2: Where is the JEDEC Tray Series manufactured?

A2: The JEDEC Tray Series is manufactured in SHENZHEN CN.

Q3: Does the JEDEC Tray Series have any certifications?

A3: Yes, the JEDEC Tray Series is certified by ISO 9001 ROHS SGS.

Q4: What is the minimum order quantity for the JEDEC Tray Series?

A4: The minimum order quantity for the JEDEC Tray Series is 500.

Q5: What is the price range for the JEDEC Tray Series?

A5: The price range for the JEDEC Tray Series is $1.5~$6 (Prices are determined according to different incoterms and quantities).

Q6: What are the packaging details for the JEDEC Tray Series?

A6: The packaging details for the JEDEC Tray Series are 70~100pcs/carton (According to the customer demand).

Q7: What is the delivery time for the JEDEC Tray Series?

A7: The delivery time for the mold is about 25 days and for the product, it is 7-10 days.

Q8: What are the payment terms for the JEDEC Tray Series?

A8: The payment terms for the JEDEC Tray Series are 100% prepayment.

Q9: What is the supply ability for the JEDEC Tray Series?

A9: The supply ability for the JEDEC Tray Series is 2000PCS/Day.