Shenzhen Hiner Technology Co.,LTD
| Packaging Details | 70~100pcs/carton(According to the customer demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Stackable | Yes |
| Material | MPPO.PPE.ABS.PEI.IDP |
| Use | Transport,Storage,Packing |
| Overall dimension*2 | 322.6x135.9x12.19MM |
| Temperature | MAX 125°C |
| Compatibility | JEDEC Standard |
| CI TYPE | SOP08 |
| Anti-Static | Yes |
| Brand Name | Hiner-pack |
| Model Number | HN23113 |
| Place of Origin | SHENZHEN CN |
| Certification | ISO 9001 ROHS SGS |
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Product Specification
| Packaging Details | 70~100pcs/carton(According to the customer demand） | Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment | Supply Ability | 2000PCS/Day |
| Stackable | Yes | Material | MPPO.PPE.ABS.PEI.IDP |
| Use | Transport,Storage,Packing | Overall dimension*2 | 322.6x135.9x12.19MM |
| Temperature | MAX 125°C | Compatibility | JEDEC Standard |
| CI TYPE | SOP08 | Anti-Static | Yes |
| Brand Name | Hiner-pack | Model Number | HN23113 |
| Place of Origin | SHENZHEN CN | Certification | ISO 9001 ROHS SGS |
| High Light | Automatic Feeding Machine JEDEC Trays ，JEDEC standard tray ，JEDEC International Standard JEDEC Trays | ||
| HN PN. | Description | External Size/mm | Pocket Size/mm | Matrix QTY |
| HN23113 | SM3490SA | 322.6x135.9x12.19 | 5.3*6.4*1.7 | 10X25=250PCS |
| TYPE | Brand | Flatness | Resistance | Service |
| BGA IC | Hiner-pack | MAX 0.76mm | 1.0x10e4-1.0x10e11Ω | Accept OEM,ODM |
The standard JEDEC TRAY structure and shape conform to international standards. This not only enables the tray to carry electronic components and meet different packaging IC requirements, but also satisfies customer demands for automatic feeding systems and automation equipment, resulting in effortless loading and increased work efficiency.
If you opt for a 100% customized JEDEC TRAY from Hiner-pack, we can provide a design solution that caters to your IC chip package's protection requirements. On our website, you can witness our extensive catalog of designed JEDEC TRAYs that fit various types of packaging, including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, and SoC, among others. Our tailored JEDEC TRAYs offer effective design solutions and wafer-level package protection for your products.
JEDEC trays are a crucial component in the semiconductor industry as they ensure the safe and efficient handling of delicate electronic components. They are widely used in semiconductor manufacturing and assembly, testing of electronic components as well as shipping and storage of integrated circuits (ICs) and other sensitive devices.
In semiconductor manufacturing, JEDEC trays play a critical role in the handling of electronic components. The trays protect the components during the manufacturing process, ensuring that they are not damaged or exposed to any harmful elements which may affect their quality or performance.
JEDEC trays are also used to test electronic components. These trays provide a secure platform for testing electronic components while ensuring they are not damaged, and that they function optimally during testing.
Finally, JEDEC trays are essential for the safe shipping and storage of integrated circuits (ICs) and other sensitive devices. These trays help to prevent damages that may occur during handling and transportation, as well as protect the devices from dust and other harmful elements that may affect their performance.
Our Custom JEDEC Trays are designed to meet the needs of the semiconductor industry. We offer a range of technical support and services to ensure that our customers receive the best possible product and experience:
Our team of professionals has years of experience in the semiconductor industry and is dedicated to providing exceptional customer service. Contact us today to learn more about our Custom JEDEC Trays and how we can assist with your semiconductor packaging needs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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