Shenzhen Hiner Technology Co.,LTD
| Packaging Details | 80~100pcs/carton(According to the customer demand） |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Anti-Static | OEM ESD ESD Tray /ESD Container PCB |
| Heat Resistant | High Temperature 270° |
| Injection Mold | Lead Time 20~25Days |
| Durable | Yes |
| Hardness | Hard |
| Height | 7.62mm |
| Reusable | Yes |
| Clean Class | General And Ultrasonic Cleaning |
| Brand Name | Hiner-pack |
| Model Number | HN23054 |
| Place of Origin | China |
| Certification | ISO 9001 SGS ROHS |
View Detail Information
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Product Specification
| Packaging Details | 80~100pcs/carton(According to the customer demand） | Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment | Supply Ability | 2000PCS/Day |
| Anti-Static | OEM ESD ESD Tray /ESD Container PCB | Heat Resistant | High Temperature 270° |
| Injection Mold | Lead Time 20~25Days | Durable | Yes |
| Hardness | Hard | Height | 7.62mm |
| Reusable | Yes | Clean Class | General And Ultrasonic Cleaning |
| Brand Name | Hiner-pack | Model Number | HN23054 |
| Place of Origin | China | Certification | ISO 9001 SGS ROHS |
| High Light | Reusable ESD Tray ，Anti Static ESD Tray ，7.62mm IC Chip Tray | ||
Each JEDEC tray we deliver can be custom-fitted to your IC's footprint—ensuring secure, ESD-safe transport.
Designed for high-reliability electronics manufacturing environments, this JEDEC matrix tray combines precise component positioning with exceptional durability and static protection. Its uniform pocket structure ensures consistent alignment of parts throughout pick-and-place, inspection, and packaging processes. With key alignment indicators and compatibility across a range of automated equipment, this tray is a practical solution for minimizing handling errors and maximizing workflow efficiency. Whether in high-volume production or custom assembly lines, it ensures components remain secure and undamaged.
• Industry Standard Format: Built to JEDEC matrix specifications, ensuring compatibility with universal tray handling and test systems.
• High-Performance ESD Protection: Composed of materials with stable conductive properties, ensuring protection from electrostatic discharge.
• Consistent Pocket Integrity: Each pocket is dimensionally stable, providing a secure fit that minimizes shifting during transport or processing.
• Automation-Optimized Structure: Integrated features such as vacuum pickup zones and mechanical orientation guides enable seamless robotic handling.
• Strong Stackability: Interlocking tray edges maintain alignment during stacking, reducing the chance of tray slippage or misfeeds.
• Operational Stability: Maintains structural integrity under typical processing environments, including temperature variation and high-cycle usage.
| Usage | Packaging of Electronic Components, Optical device |
| Feature | ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material | MPPO, PPE, ABS, PEI, IDP, etc. |
| Color | Black, Red, Yellow, Green, White, and custom color |
| Size | Customized size, rectangle, circle shape |
| Mold type | Injection Mold |
| Design | Original sample, or we can create the designs |
| Packing | By Carton |
| Sample | Sample time: after the draft is confirmed and payment is arranged |
| Sample charge: 1. Free for stock samples 2. Custom Tray negotiated | |
| Lead Time | 5-7 Working days |
| The exact time should be according to the ordered quantity |
To support a broad range of unique part requirements and handling workflows, the tray can be customized in multiple ways:
• Custom Pocket Design: Pocket size and arrangement can be adjusted to accommodate non-standard component shapes or fragile structures.
• Color Customization: ESD-safe tray materials can be produced in various colors for easy part family or line identification.
• Integrated Identification Features: Permanent tray ID markers can be molded during production for traceability and inventory control.
• Modified Edge Profiles: Tray edges and alignment features can be tailored to improve compatibility with specific feeders or automation tools.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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