Payment Terms | L/C, T/T |
Supply Ability | 100K a month |
Delivery Time | 3 to 5 days |
Type | External |
Interface | Type-C is compatible with USB3.0 / USB3.1 / USB3.2 |
Protocol | NVMe/NGFF transport protocol |
Transmission speed | 10Gb/s-20Gb/s |
Color | Custom |
Warranty | 3 years |
Application | Laptop / Desktop / Notebook |
Orign | GUA, China |
Brand Name | PG |
Place of Origin | China |
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Product Specification
Payment Terms | L/C, T/T | Supply Ability | 100K a month |
Delivery Time | 3 to 5 days | Type | External |
Interface | Type-C is compatible with USB3.0 / USB3.1 / USB3.2 | Protocol | NVMe/NGFF transport protocol |
Transmission speed | 10Gb/s-20Gb/s | Color | Custom |
Warranty | 3 years | Application | Laptop / Desktop / Notebook |
Orign | GUA, China | Brand Name | PG |
Place of Origin | China | ||
High Light | Custom Color Portable External SSD ,External SSD 512GB For Notebook ,2.5 Inch SATA SSD External Hard Drive |
High Data Transfer Speeds:
Compact and Portable Design:
Plug-and-Play Functionality:
Compatibility:
Durability:
Security Features:
Capacity | 128GB/256GB/512GB/1TB/2TB/4TB |
Transmission speed | 10Gb/s-20Gb/s |
External interface | type-C compatible with USB3.0/USB3.1/USB3.2 |
Supportive system | Windows/Mac 0S8.6 and higher versions |
Main materials | aluminum alloy main structure, with stronger heat dissipation; Safer protection of hard drive data |
Suitable for hard drives | NVMe/NGFF transport protocol |
Storage temperature | -20℃~70℃ |
Storage humidity | 5℃~90℃ |
Operating humidity | 0℃~80℃ |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Total Annual:
5000000-8000000
Employee Number:
80~100
Ecer Certification:
Verified Supplier
China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...
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