Changzhou Mingseal Robot Technology Co., Ltd.
| Payment Terms | L/C,D/A,D/P,T/T,Western Union |
| Delivery Time | 5-60 Days |
| Packaging Details | Wooden Case |
| Warranty | 1 Year |
| Voltage | 110V/220V |
| Positioning accuracy | X/Y: ±10μm |
| Weight | 2.9T |
| Brand Name | Mingseal |
| Model Number | SS101 |
| Certification | ISO CE |
| Place of Origin | China |
View Detail Information
Explore similar products
FCBGA Packaging Jet Underfill Dispenser CUF Inline Cnc Glue Dispenser ISO
FCBGA SiP Inline Jet Underfill Dispensing Machine FCCSP Electronic Dispensing
FCCSP FCBGA Advanced Packaging Machine Automatic Lid Attachment System
130W Advanced Packaging Machine Wafer Level Underfill Flux Jetting Machine
Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,Western Union | Delivery Time | 5-60 Days |
| Packaging Details | Wooden Case | Warranty | 1 Year |
| Voltage | 110V/220V | Positioning accuracy | X/Y: ±10μm |
| Weight | 2.9T | Brand Name | Mingseal |
| Model Number | SS101 | Certification | ISO CE |
| Place of Origin | China | ||
| High Light | RDL Advanced Packaging Equipment ，Underfill Advanced Packaging Equipment ，ISO Wafer Level Dispensing Machine | ||
Advanced RDL First WLP Underfill Wafer-Level Dispensing Machine
The evolution of advanced semiconductor devices, such as 2.5D and fan-out wafer-level packaging, demands ultra-reliable underfill processes at the wafer stage. The SS101 is engineered to address these challenges by providing a highly stable dispensing environment within a controlled Class 10 cleanroom-compatible enclosure, supported by precise temperature management and real-time monitoring.
Equipped with an open communication protocol and compliant with international semiconductor ESD standards (IEC & ANSI), the SS101 seamlessly connects with existing factory information management systems — supporting modern smart fab and unmanned operation needs.
Core Advantages
Application Areas
✔ RDL First Wafer-Level Packaging (WLP)
✔ Chip Underfill (CUF) Applications
✔ Advanced 2.5D and Fan-Out Packaging
✔ Wafer-Level CoWoS, FoPoP, and similar next-gen processes
✔ High-yield underfill lines for large-volume semiconductor fabs
System Composition
Loadport & Foup
Aligner
Code scanning station
Preheating station
Heat dissipation station
GS600SWA dispensing machine operation station
GS600SWB dispensing machine operation station
Robot handling module
FAQ
Q1: What makes the SS101 different from standard dispensing systems?
A: Unlike general-purpose dispensers, the SS101 is specialized for wafer-level underfill with wafer alignment, preheating, and robotized transfer built in — ensuring uniform filling at micro-bump scales.
Q2: Can the SS101 handle both 8-inch and 12-inch wafers?
A: Yes — it is designed to support both sizes, with 12-inch FOUP compatibility as standard and optional 8-inch open cassette configuration.
Q3: How does the SS101 help reduce wafer contamination?
A: Its Class 10 dispensing zone and seamless robot handling minimize manual intervention, dust ingress, and ESD risk.
Q4: Is the SS101 easy to integrate into existing fabs?
A: Absolutely — it supports SEMI-compliant wafer readers, AMHS interfaces, and standard factory communication protocols.
About Mingseal
Mingseal is a globally recognized provider of high-precision dispensing, coating, and wafer-level fluid process solutions. We empower semiconductor, optical, and advanced packaging manufacturers with innovative automation equipment that drives yield, consistency, and smart factory goals. From high-volume wafer underfill to cutting-edge 2.5D integration, Mingseal delivers stable performance, local service, and trusted engineering support worldwide.
Contact Mingseal to discover how the SS101 Wafer-Level Dispensing Machine can take your advanced packaging capabilities to the next level.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
10000000-50000000
Employee Number:
500~600
Ecer Certification：
Verified Supplier
Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog... Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog...
Get in touch with us
Leave a Message, we will call you back quickly!