Changzhou Mingseal Robot Technology Co., Ltd.
| Payment Terms | L/C,D/A,D/P,T/T,Western Union |
| Supply Ability | 30-40 sets/month |
| Delivery Time | 5-60 Days |
| Packaging Details | Wooden Case |
| Dimensions | 770×1200×1450mm |
| Support 360° Rotation | Yes |
| Substrate Thickness | 0.1~9mm |
| Brand Name | Mingseal |
| Model Number | FS600A |
| Certification | ISO CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,Western Union | Supply Ability | 30-40 sets/month |
| Delivery Time | 5-60 Days | Packaging Details | Wooden Case |
| Dimensions | 770×1200×1450mm | Support 360° Rotation | Yes |
| Substrate Thickness | 0.1~9mm | Brand Name | Mingseal |
| Model Number | FS600A | Certification | ISO CE |
| Place of Origin | China | ||
| High Light | 2.8KW Advanced Packaging Equipment ，50Hz Advanced Packaging Equipment ，SiP Packaging auto Dispensing Machine | ||
Inline Visual Dispensing Machine for Dam & Fill and SiP Packaging
The FS600 Series Inline Visual Dispensing Machine is an intelligent, cost-efficient solution developed specifically for Dam & Fill processes and SiP (System in Package) semiconductor packaging. With an optimized price-performance ratio, this inline dispensing system delivers the high precision and stability that advanced microelectronics manufacturers demand—without the premium price tag of traditional cleanroom equipment.
Targeted at applications where dam structures (e.g., solder dam or epoxy dam) and fill encapsulation must be controlled to micro-level accuracy, the FS600 integrates dedicated process modules for inline inspection. During Dam creation, real-time cameras and sensors measure glue width and bead height to maintain perfectly formed barriers around sensitive dies and circuits. For Fill, the machine precisely controls filling volume to prevent voids and ensure reliable protection for high-density chip packaging.
Core Advantages
Typical Applications
✔ Dam & Fill encapsulation for SiP packaging
✔ Solder dam lines for die and wire protection
✔ Fill processes for void-free encapsulation of stacked chips
✔ BGA/CSP edge sealing
✔ Corner glue or underfill for advanced PCBA modules
✔ Inline process control with glue width/thickness measurement
✔ Smart factory traceability with MES docking
Technical Specifications
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FS600A Online Visual Dispensing |
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Frame Structure |
Floor-mounted gantry 3-axis |
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Dimensions W*D*H (w/o Loading & Unloading) |
770×1200×1450mm |
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Weight |
800kg |
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Power Supply |
220V AV 50Hz |
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Power |
2.8KW |
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Dustproof Level |
Class100 |
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ESD |
Optional |
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Working Environment Temperature |
23℃±5℃ |
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Relative Humidity of Working Environment |
20 ~ 90% |
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Motion System |
Transmission Mechanisms |
X/Y:Linear motor Z: Servo motor&Screw module |
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Repeatability |
X/Y: ±0.01mm Z: ±0.005mm |
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Positioning Accuracy |
X/Y: ±0.015mm Z: ±0.01mm |
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Max. Movement Speed |
X/Y: 1300mm/s Z:500mm/s |
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Max. Accelerated Velocity |
X/Y: 1.3g Z: 0.5g |
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Work platform parameters |
Visual Positioning Method |
Mark/Product appearance features |
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Weighing Accuracy |
0. 1mg/0.01mg |
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Track Load-bearing Capacity |
3kg |
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Track Width Adjustment Range (Single track) |
35~520mm |
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Substrate Thickness |
0. 1~9mm |
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Minimum Board Edge Gap |
4mm |
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Z axis Motion Range |
40mm |
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Dispensing range (W*D) |
Max. Dispensing Range -with Loading & Unloading (Single track) |
280×170mm |
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Double Valve Synchronous-w/o compensation-Manual adjustment (Single track/Double track) |
220×520mm/220×215mm |
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Double Valve Asynchronous (Single track/Double track) |
315×520mm/315×215mm |
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Left-right Tilt Rotation (Single track/Double track) |
180×480mm/180×195mm |
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Back & forth Tilt Rotation (Single track/Double track) |
280×425mm/280×165mm |
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360° Rotation (Single track/Double track) |
240×455mm/240×180mm |
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FAQ
Q1: Why is inline Dam width/thickness monitoring important?
A: Precise dam structures prevent overflow and protect delicate chip areas. The FS600’s real-time measurement module ensures each bead stays within tolerance, reducing rework.
Q2: How does Fill volume monitoring help yield?
A: By verifying fill amount inline, voids are prevented, guaranteeing stronger encapsulation—crucial for SiP reliability and thermal cycling performance.
Q3: Is the FS600 only for cleanroom lines?
A: No. While suitable for semi-clean or standard SMT environments, its mineral-cast frame ensures vibration damping and dust control, so you get near cleanroom results at a fraction of the cost.
Q4: Can I integrate this with my MES?
A: Absolutely. The FS600 Series comes MES-ready with SMEMA standard interfaces, easy inline linking, and real-time data logging for full traceability.
About Mingseal
Mingseal specializes in high-precision inline and desktop dispensing solutions for semiconductors, SiP, MEMS, SMT, and next-gen electronics. With thousands of installations worldwide, we help factories push the limits of process control, yield, and smart automation—while always delivering solid ROI and robust local support.
Contact us today to see how the FS600 Series can upgrade your Dam & Fill production line for less.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
10000000-50000000
Employee Number:
500~600
Ecer Certification：
Verified Supplier
Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog... Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog...
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