High Speed Advanced Packaging Equipment 300mm/S Inline Dispensing System For

Product Specification

High-Speed Inline Dispensing System for FCBGA & Flux Spraying

The GS600 series is a next-generation, high-speed inline dispensing system engineered for the precise demands of FCBGA encapsulation and related semiconductor packaging processes. Designed specifically for flux spraying on the substrates and the critical pre/post stages of indium sheet mounting, this advanced system helps manufacturers meet strict yield and quality requirements for today’s high-density semiconductor packages.

For modern smart factories, process reliability is critical — GS600SS is equipped with a real-time glue weight monitoring function and an automatic alarm system that instantly detects abnormal volumes, protecting production runs from glue shortages or inconsistency. This ensures reliable flux application across large batches, minimizing rework and maximizing yield.

Key Advantages

• High-Precision Motion: Grating ruler and linear motor combination maintains micron-level repeatability under continuous high-speed operation.

• Real-Time Process Control: Automated glue weight check and instant alarm system reduce risk of under-dispensing and protect yield.

• Flexible Valve Compatibility: Supports both spray and jet valves, easily switching to meet varying flux or coating requirements.

• Optimized for Indium Sheet Processes: Specially designed for flux spraying before and after indium sheet mounting, ensuring excellent adhesion and process consistency.

• Easy Inline Integration: Standard SMEMA interface and adjustable track system make integration with SMT or DB lines seamless.

Application Fields

✓ FCBGA Encapsulation
✓ Flux Spray/Jetting
✓ Conductive-coating
✓ EMI Shielding 

Core Modules

Piezoelectric Valve

Piezoelectric jetting system

Flux overflow edge precision control

Spray Valve

Flux piezoelectric spray system

Piezoelectric ceramic drive to control the glue amount

Meeting the ultra-thin flux coating requirements in the indium sheet process

Visual System

Compatible with 2D Mark positioning and product feature positioning

Supporting automatic substrate anti-reverse, fixed-shooting and fly-shooting modes and bad Mark recognition, and auto-skipping

Weighing System

Automatic glue weight confirmation and alarm in case of any abnormity to avoid poor batch operation caused by lack of glue

FAQ

Q1: Why is GS600 series ideal for FCBGA and indium sheet processes?
A: Its micron-level accuracy, stable linear motor drive, and real-time glue weight monitoring ensure precise flux coverage and consistent process control during delicate pre/post indium sheet mounting steps.

Q2: Can it handle both spray and jet applications?
A: Yes, GS600SS supports high-precision spray valves like KAS1000 and jet valves, allowing quick changeover for different flux or coating requirements.

Q3: How does it integrate with my SMT line?
A: The system is fully compatible with SMT/DB lines using standard SMEMA interface and adjustable track width/height for easy inline or tandem setup.

Q4: Does it have heating functions?
A: Yes, the track includes a preheat section (reserved), dispensing zone heating, and optional unloading heat section to ensure optimal material performance.

About MingSeal

Changzhou MingSeal Robot Technology Co., Ltd. (MingSeal) is a technology-driven precision equipment manufacturer established in 2008. We focus on advanced dispensing, soldering, and micro-assembly solutions for semiconductor packaging, precision electronics, and smart manufacturing.
Visit us at www.mingsealdispenser.com to learn more about our full range of high-performance systems.