Shenzhen Chaosheng Electronic Technology Co.,Ltd

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Halogen Free PCB Printing Service 12 Layer Carbon Oil FR4 TG 140 Type PCB Board

China Halogen Free PCB Printing Service 12 Layer Carbon Oil FR4 TG 140 Type PCB Board

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Halogen Free PCB Printing Service 12 Layer Carbon Oil FR4 TG 140 Type PCB Board

MOQ： 1PCS
Price：
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Payment Terms	T/T, Western Union
Supply Ability	500000pcs per month
Delivery Time	15-18day
Packaging Details	Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Areas	Medical Bluetooth Module Motherboard
Material	FR-4 TG150
Minimum Line Width And Space	4/3mil
Minimum Hole	0.15mm
Product Structure	12 Layers
Impedance Value	±10%
Carbon Resistance Test	±10%
Surface Treatment	Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Carbon resistance test	100%
E-Test	100%
Brand Name	China chao sheng
Model Number	CSPCB1518
Certification	ISO/UL/RoHS/TS
Place of Origin	Shenzhen, Guangdong, China

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Product Details
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Product Specification


Payment Terms	T/T, Western Union	Supply Ability	500000pcs per month
Delivery Time	15-18day	Packaging Details	Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Areas	Medical Bluetooth Module Motherboard	Material	FR-4 TG150
Minimum Line Width And Space	4/3mil	Minimum Hole	0.15mm
Product Structure	12 Layers	Impedance Value	±10%
Carbon Resistance Test	±10%	Surface Treatment	Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Carbon resistance test	100%	E-Test	100%
Brand Name	China chao sheng	Model Number	CSPCB1518
Certification	ISO/UL/RoHS/TS	Place of Origin	Shenzhen, Guangdong, China
High Light	dual layer pcb ，flexible printed circuit board

12layer carbon oil + FR4 TG 140, type PCB, multilayer pcb board PCB Requirements

Learn PCB Service Requirements on the PCB The PCB assembly PCB DFM Requirements

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Detailed Product Description

Product Areas:	Medical Bluetooth Module Motherboard	Minimum Line Width And Space:	3/3mil
Material:	Halogen-free FR-4 TG150	Minimum Hole:	0.10mm
Aspect Ratio:	10:1	Product Structure:	10 Layers AnylayerHDI
Impedance Value:	± 10%	Surface Treatment:	Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information:	Gberber, Production Requirements, MOQ Quantity	PCBA Information:	BOM Report, X, Y Left Plot
E-Test:	100% Electrical Test Prior Shipment

10 layers AnylayerHDI, Halogen-free FR-4 TG150 Thick copper + thick gold inner and outer copper, HDI Printed Circuit Boards, prototype pcb fabrication

1: Medical Bluetooth module motherboard
2: Halogen-free FR-4 TG150, inner and outer copper thickness 35um, minimum line width line spacing 3/4mil, hole ratio 10:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
3: The board thickness is 1.60mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

100% E - Test Printed Circuit Board Assembly Services 10 Layers Anylayer HDI

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

Graphite Plugged Bushings

from Quality China Factory

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Business Type:

Manufacturer,Importer,Exporter,Seller 
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Year Established:

1997 
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Total Annual:

716277898-736287698
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Employee Number:

2500~2768 
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Ecer Certification：

Active Member 

Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...

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Shenzhen Chaosheng Electronic Technology Co.,Ltd
Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong
http://www.pcbboardservice.com/

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