Small Size 15W No Contact UV Laser PCB Depanelizer For Burr Free Cutting

Product Specification

Small Size UV Laser PCB Depaneling Machine Makes Clean and Burr-free Cuts

UV Laser Depaneling Description:

UV laser depaneling is a precise and efficient method used in the electronics manufacturing industry to separate printed circuit boards (PCBs) or panels into individual units. It employs a high-intensity ultraviolet (UV) laser beam to selectively ablate or vaporize material along predefined cutting paths, creating clean and precise separations.

Here is a step-by-step description of the UV laser depaneling process:

1. Panel Preparation: The PCB panel, which contains multiple PCBs or circuits, is loaded onto the UV laser depaneling machine. The panel may be secured in place using clamps, fixtures, or other alignment mechanisms to ensure stability during the cutting process.

2. Set Cutting Parameters: The operator sets the cutting parameters, which include the cutting path, speed, power, and laser focus, based on the specific requirements of the PCB design and material.

3. Alignment and Vision Systems: Some UV laser depaneling machines incorporate vision systems or cameras to precisely locate fiducial marks or registration points on the panel. This helps align the cutting path with the PCB layout, ensuring accurate and consistent separations.

4. Laser Cutting: The UV laser beam is directed onto the target PCB area along the predefined cutting path. The high-energy laser interacts with the material, causing it to vaporize or ablate. The intense localized heat generated by the laser beam removes the material layer by layer, creating a clean and precise separation without causing thermal damage to the surrounding PCB components.

5. Real-Time Monitoring: Advanced UV laser depaneling machines may include real-time monitoring systems to detect and adjust for any variations or anomalies during the cutting process. These monitoring systems ensure the accuracy and quality of the depaneling operation.

6. Waste Removal: As the laser cuts through the material, the waste material (such as PCB dust or vaporized particles) is typically removed through an exhaust system or suction nozzles. This helps maintain a clean work environment and prevents debris from interfering with subsequent cutting operations.

7. Inspection and Quality Control: After the depaneling process, the individual PCBs are inspected for any defects, such as incomplete cuts, burrs, or damage. Quality control measures ensure that the separated PCBs meet the required specifications and are free from any structural or electrical issues.

UV Laser Depaneling Advantages:

UV laser depaneling offers several advantages over traditional depaneling methods:

• Precision and Accuracy: The focused UV laser beam allows for micron-level precision, enabling intricate cutting patterns and tight tolerances. It ensures clean and precise separations, minimizing the risk of damage to PCB components or traces.

• Minimal Cutting Stress: UV laser depaneling produces minimal heat-affected zones, reducing the risk of thermal stress or damage to sensitive electronic components. It is especially suitable for cutting delicate or heat-sensitive materials.

• Flexibility: UV laser depaneling can handle various PCB materials, including rigid, flex, and rigid-flex boards. It is suitable for complex PCB designs with intricate contours or irregular shapes.

• Minimal Tooling or Fixturing: Unlike mechanical depaneling methods, inline UV laser depaneling does not require physical tooling or fixtures. It offers greater flexibility and reduces setup time and costs.

• Reduced Material Waste: UV laser depaneling produces minimal waste and kerf width, optimizing material utilization and reducing overall production costs.

UV laser depaneling is a reliable and efficient technique that ensures precise and clean separations of PCBs in electronics manufacturing. Its accuracy, speed, and versatility make it a preferred choice for high-quality PCB assembly processes.

UV Laser Depaneling Specification:

Suitable Processing Materials

Flexible circuit boards, rigid circuit boards, rigid-flex circuit board sub-board processing.

Rigid, flexible circuit board sub-board processing component is installed.

Thin copper foil, a pressure-sensitive adhesive sheet (PSA), an acrylic film, a polyimide coating film.

Thickness of 0.6mm or less precision ceramic cutting, dicing; variety of cutting the base material (silicon, ceramics, glass, etc.)

Etching precision molding various functional films, an organic film and other precision cutting.

Polymer: polyimide, polycarbonate, polymethyl methacrylate, FR-4, PP, etc.

Functional film: gold, silver, copper, titanium, aluminum, chromium, ITO, silicon, poly-crystalline silicon, amorphous silicon and a metal oxide.

Brittle material: monocrystalline silicon, polycrystalline silicon, ceramic and sapphire.

Laser Depaneling Machine Details:

FAQ:

Q: What kind of PCBs are workable to use this machine?

A: FPC and FR4 panels, covering v score and tab boards.

Q: What is laser head of the machine?

A: We use USA Optowave laser.

Q: What kind of laser source you provide?

A: Green, CO2, UV and picosecond.

Q: What is cutting speed?

A: It depends on PCB material, thickness and cutting effect requirements.

Q: Does it cause dust during cutting?

A: No dust, but smoke, machine comes with exhaust system and water cooler

Shipping Ways:

1. DHL/FedEx/UPS/TNT Express

2. Air

3. Railway

4. Ocean

5. Truck