Beijing Haina Lean Technology Co., Ltd
| Payment Terms | T/T, Western Union, L/C, MoneyGram |
| Supply Ability | 10,000,000 Point /Day |
| Delivery Time | 1-7days |
| Packaging Details | ESD packaging with carton box |
| Product name | ENIG multi-layering 1oz HDI Printed Circuit Board |
| Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
| Copper thickness | 1oz |
| Min. line Width/spacing | 0.21＊0.26mm |
| Min. hole size | 0.26mm |
| Usage | OEM Electronics,Circuit Board Assembly |
| Board thickness | 2.0mm |
| solder mask | Green. Black. Red. Yellow. White. Blue etc.; custom |
| Type | buried vias and through vias |
| Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD |
| Brand Name | HNL-PCBA |
| Model Number | PCB Assembly 012 |
| Certification | ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T, Western Union, L/C, MoneyGram | Supply Ability | 10,000,000 Point /Day |
| Delivery Time | 1-7days | Packaging Details | ESD packaging with carton box |
| Product name | ENIG multi-layering 1oz HDI Printed Circuit Board | Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
| Copper thickness | 1oz | Min. line Width/spacing | 0.21＊0.26mm |
| Min. hole size | 0.26mm | Usage | OEM Electronics,Circuit Board Assembly |
| Board thickness | 2.0mm | solder mask | Green. Black. Red. Yellow. White. Blue etc.; custom |
| Type | buried vias and through vias | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD |
| Brand Name | HNL-PCBA | Model Number | PCB Assembly 012 |
| Certification | ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000 | Place of Origin | CHINA |
| High Light | through vias hdi pcb board ，8layers hdi pcb board ，1oz hdi multilayer pcb | ||
High Density Interconnection,shorted as (HDI) PCB, is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. Adopting the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality problem of signal transmission, insulating materials with low dielectric constant and low attenuation rate are used. To meet the miniaturization and arraying of electronic components, the density of circuit boards is constantly increasing to meet the demand.
PCB CAPABILITIES
| FACTORY CAPABILITIES | |||
| No. | Items | 2019 | 2020 |
| 1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
| 2 | Max layer count | 32L | 36L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
| Mechnical 0.15mm | Mechnical 0.15mm | ||
| 5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
| 10 | Min.BGA PAD | 0.15mm | 0.125mm |
| 11 | Max Aspect Ratio | 10:1 | 10:1 |
| 12 | Bow and Twist | 0.50% | 0.50% |
| 13 | Impedance Control Tolerance | +/-8% | +/-5% |
| 14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI | |
1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.
HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.
Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment
Our PCB are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.
Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Q1:What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q2:Is my PCB files safe when I submit them to you for manufacturing?
We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from you, nor we'll share these files with any other 3rd parties.
Q3:What payments do you accept ?
-Telex Transfer(T/T),Western Union,Letter of Credit(L/C)
-Paypal,AliPay,Credit Card
Q4:How to get the PCB?
A:For small packages, we will ship the boards to you by DHL,UPS,FedEx,EMS. Door to door service! You will get your PCBs at your home.
B:For heavy goods more than 300kg, we may ship your boards by ship or by air to save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.
Q5:What is your minimum order quantity?
Our MOQ is 1 PCS.
Q6: Can we visit your company?
No problem. You are welcome to visit us in Beijing. Or the branch factory is in Tianjin.
Q7: How can you ensure the quality of the PCB?
Our PCBs are 100% test including Flying Probe Test, E-test and AOI.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2006
Total Annual:
600-1000
Employee Number:
200~300
Ecer Certification：
Active Member
ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ... ecer({videoId:"pzc2uJV-5ho",idContainer:"#EdhmScD"}) Beijing Haina Lean Technology Co., Ltd is one of the most professional PCB manufacturer in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production ...
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