FC-TSDO-0824 DO 8CH FCTSDO0824 SM ESD HTAL Module

Product Specification

FC-TSDO-0824 MODULE DO 8CH FCTSDO0824 SM ESD HTAL MODULE, TYPE: 8 CHANNEL DIGITAL OUTPUT,POWER SOURCE: 30/42 VDC

IO chassis The IO chassis (IOCHAS) is one mechanical housing, which contains the horizontal IOBus back plane, the IO module housing, the IO backplane, a cable tray, and is covered at the back. The IO chassis containing 18 IO slots. It also contains an IO backplane, IO extenders and IO busses. IO chassis are available for redundant and nonredundant IO. The IO backplane (IOB) consists of a multi-layer PCB, with one layer being an earth plane to improve EMC/RFI immunity. The front side of the IO backplane contains the Eurocard connectors to install the IO modules and the IO extender module(s). At the back, the IO backplane provides female connectors for the system interconnection cables (SICs), which also connect to the FTA modules. The backside also provides programming connectors, which allow the IO interfaces to be tailored to the specific signal characteristics of the field equipment, e.g. digital line-monitored output impediance, Low, Medium, High or Spare. Integrated in the IO backplane is the internal and external power distribution to the IO modules,

IO bus The Control Processor controls IO (located in the IO chassis) via an IO bus. An IO extender (located in the IO chassis) communicates with the individual IO modules via a horizontal IO bus. The Control Processor interfaces with the IO system through a IO bus, which is a flatcable that runs vertically in the cabinet. The IO-bus is controlled by the IO Bus Driver function, which is part of the QPP module.

Each of the IO chassis contains a IO extender IO-0001 module, which connects to the IO-bus. The IO extender module drives the Horizontal IO Bus, which relays the signals from the IO-bus to the IO modules via a flatcable. The Horizontal IO bus back plane is located on top of each IO chassis. The Horizontal IO bus and the flatcables of the IO modules are covered with a sheet steel cover which provides optimum EMC/RFI immunity. The cover plate contains a paper strip which holds the relevant process tagging for signal identification.

IO modules The IO modules are constructed on a European standard-size instrument card. The height of the front panel of the modules is 3 HE (3U), their width is 4 TE (4 HP). A total of 18 IO modules can be placed per IO chassis. All IO modules are equipped with standard 32-pin DIN 41612F connectors. All IO chassis are provided with an IO backplane, which contains matching 32-pin connectors with key coding to prevent mis-insertion of the IO modules.

Ironman Technology Co.,LTD

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