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Dayoo Advanced Ceramic Co.,Ltd

  • China,Jinhua ,Zhejiang
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China High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation
China High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation

  1. China High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation

High-Power Electronic Devices Alumina Ceramic Substrates With Heat Dissipation

  1. MOQ: Negotiable
  2. Price: Negotiable
  3. Get Latest Price
Delivery Time Negotiable
Payment Terms Negotiable
Transparency Opaque
Bulk Density >3.63
Method lsostatic presure
Tensile Strength 250 MPa
Alumina Content 92% & 95%
Mechanical Strength Very High
Hardness 9 Mohs
Dielectric Constant 9.8
Dimensional Tolerance ±0.001 mm
Precision Tolerance High
Maximum Operating Temperature 1,500°C
Surface Finish Polished
Type Nozzles
Properties electric insulation
Size Customized
Place of Origin Made In China
Brand Name Dayoo

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  1. Product Details
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Product Specification

Delivery Time Negotiable Payment Terms Negotiable
Transparency Opaque Bulk Density >3.63
Method lsostatic presure Tensile Strength 250 MPa
Alumina Content 92% & 95% Mechanical Strength Very High
Hardness 9 Mohs Dielectric Constant 9.8
Dimensional Tolerance ±0.001 mm Precision Tolerance High
Maximum Operating Temperature 1,500°C Surface Finish Polished
Type Nozzles Properties electric insulation
Size Customized Place of Origin Made In China
Brand Name Dayoo
High Light High Wear Alumina CeramicChemical Resistance Alumina Ceramic

High-Power Electronic Devices Alumina Ceramic Substrates with Heat Dissipation and Superior Insulation

 

Product Introduction

Our alumina ceramic insulation heat sink substrates are manufactured from 99.6% high-purity alumina material, specifically engineered for thermal management and electrical insulation requirements in high-power electronic devices. Featuring excellent thermal conductivity (24-30W/(m·K)) and ultra-high insulation strength (>15kV/mm), with precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates represent the ideal solution for high-temperature, high-power applications including power semiconductors, LEDs, and IGBT modules.

Primary Applications

  • Power Electronics: IGBT modules, MOSFETs, thyristor heat sinks

  • LED Lighting: High-power LED chip packaging substrates

  • New Energy Vehicles: Motor controllers, charging pile power modules

  • 5G Communications: Base station power amplifier heat sinks

  • Industrial Control: Frequency converters, servo drive power units

Key Advantages

Efficient Heat Dissipation: Thermal conductivity up to 30W/(m·K), 10× better than standard PCBs
Superior Insulation: Breakdown voltage >15kV/mm, volume resistivity >10¹⁴Ω·cm
High-Temperature Resistance: Continuous operation up to 850°C
Dimensional Stability: CTE 7.2×10⁻⁶/℃, excellent match with chips
Precision Machining: Flatness ≤0.02mm/50mm, laser-cuttable

Technical Specifications

Parameter Standard (96%) High-Performance (99.6%)
Al₂O₃ Content 96% 99.6%
Thermal Conductivity (W/(m·K)) 24 30
Flexural Strength (MPa) 300 400
Dielectric Constant (1MHz) 9.5 9.2
Thickness Range (mm) 0.25-5.0 0.25-5.0
Maximum Size (mm) 150×150 150×150

Precision Manufacturing Process

  1. Powder Preparation: High-purity alumina powder (D50≤0.8μm)

  2. Tape Casting: Precise slurry viscosity and thickness control

  3. Isostatic Pressing: 200MPa high-pressure densification

  4. Atmosphere Sintering: 1650°C hydrogen-protected sintering

  5. Precision Machining: Double-side grinding + laser cutting

  6. Surface Treatment: CMP polishing to Ra 0.1μm

  7. Full Inspection: AOI + insulation testing

Installation Guidelines

Professional Recommendations:

  • Soldering temperature <280°C, duration <10 seconds

  • Apply thermal grease to enhance thermal contact

  • Avoid mechanical impact and localized stress concentration

  • Storage humidity <60% RH

  • Recommend regular insulation checks (every 5,000 hours)

Service Commitment

  • Technical Support: Thermal simulation analysis services

  • Rapid Response: 48-hour expedited delivery for standard sizes

  • Customization: Special shapes and metallization treatments available

  • Failure Analysis: SEM+EDS testing laboratory equipped

Technical FAQ

Q: How to select proper substrate thickness?
A: 0.63mm recommended for general power devices, ≥1.0mm for high-power applications

Q: Is double-side metallization possible?
A: Supports thick-film printing, thin-film sputtering, DBC and other metallization processes

Q: How to ensure reliability in vibration environments?
A: Recommend our patented edge reinforcement structure design

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter

  • Total Annual:

    >1000000

  • Employee Number:

    >100

  • Ecer Certification:

    Verified Supplier

We are a company with many years of experience in the production of special precision ceramics and the ability to design, manufacture, process and sell structural and functional parts of various special precision ceramics.   Deyu Precision Ceramics Technology Co., Ltd. has many years of e... We are a company with many years of experience in the production of special precision ceramics and the ability to design, manufacture, process and sell structural and functional parts of various special precision ceramics.   Deyu Precision Ceramics Technology Co., Ltd. has many years of e...

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  • Dayoo Advanced Ceramic Co.,Ltd
  • No. 6, Shuangjin Street, Qiubin Industrial City, Qiubin Street, Wucheng District, Jinhua, Zhejiang
  • https://www.precision-ceramicparts.com/

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