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China factory - Dayoo Advanced Ceramic Co.,Ltd

Dayoo Advanced Ceramic Co.,Ltd

  • China,Jinhua ,Zhejiang
  • Verified Supplier

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China High Thermal Conductivity Superior Insulation Low Thermal Expansion High
China High Thermal Conductivity Superior Insulation Low Thermal Expansion High

  1. China High Thermal Conductivity Superior Insulation Low Thermal Expansion High

High Thermal Conductivity Superior Insulation Low Thermal Expansion High

  1. MOQ: Negotiable
  2. Price: Negotiable
  3. Get Latest Price
Delivery Time Negotiable
Payment Terms Negotiable
Corrosion Resistance Excellent
Purity 96%,99%
Shape Customizable
Precision Tolerance High
Alumina Content 92% & 95%
Color White
Low Thermal Expansion Excellent
Tensile Strength 250 MPa
Electrical Insulation Excellent
Dielectric Loss 0.0002
Thermal Shock Resistance Excellent
Mechanical Strength High
High Temperature Resistance Yes
Non-Toxic Yes
Thermal Conductivity 35 W/mK
Dimensional Tolerance ±0.001 mm
Place of Origin Made In China
Brand Name Dayoo

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  1. Product Details
  2. Company Details

Product Specification

Delivery Time Negotiable Payment Terms Negotiable
Corrosion Resistance Excellent Purity 96%,99%
Shape Customizable Precision Tolerance High
Alumina Content 92% & 95% Color White
Low Thermal Expansion Excellent Tensile Strength 250 MPa
Electrical Insulation Excellent Dielectric Loss 0.0002
Thermal Shock Resistance Excellent Mechanical Strength High
High Temperature Resistance Yes Non-Toxic Yes
Thermal Conductivity 35 W/mK Dimensional Tolerance ±0.001 mm
Place of Origin Made In China Brand Name Dayoo
High Light Advanced Material Alumina CeramicHigh Performance Alumina CeramicHigh Performance Alumina Ceramic Material

High Thermal Conductivity Superior Insulation Low Thermal Expansion High-Temperature Resistance Exceptional Flatness

 

Product Introduction

Alumina ceramic substrates are electronic ceramic base plates manufactured from high-purity alumina (Al₂O₃ content 96%-99.9%), featuring excellent insulation properties, high thermal conductivity and low dielectric loss. With precision-polished surfaces achieving roughness below Ra 0.1μm, these substrates are ideal for high-end applications including power electronic devices, LED packaging, and semiconductor modules.

Primary Applications

  • Power Electronics: IGBT module substrates, power MOSFET heat dissipation bases

  • LED Lighting: High-power LED chip packaging substrates

  • Semiconductors: RF/microwave circuit substrates, MEMS device carriers

  • Automotive Electronics: New energy vehicle electronic control system heat sinks

  • 5G Communications: Base station power amplifier heat dissipation substrates

Key Advantages

High Thermal Conductivity: 24-30W/(m·K), 10× better than standard PCB materials
Superior Insulation: Volume resistivity >10¹⁴Ω·cm
Low Thermal Expansion: 7.2×10⁻⁶/℃, excellent match with silicon wafers
High-Temperature Resistance: Continuous operation up to 850℃
Exceptional Flatness: ≤0.02mm/50mm surface flatness

Technical Specifications

Parameter Standard (96%) High Thermal (99%)
Al₂O₃ Content 96% 99%
Thermal Conductivity 24W/(m·K) 30W/(m·K)
Dielectric Constant 9.5(1MHz) 9.2(1MHz)
Flexural Strength 300MPa 350MPa
Thickness Range 0.25-5mm 0.25-5mm
Maximum Size 150×150mm 150×150mm

Manufacturing Process

  1. Powder Preparation: High-purity alumina powder (D50≤1μm)

  2. Tape Casting: Precise slurry viscosity and thickness control

  3. Isostatic Pressing: 200MPa high-pressure densification

  4. High-Temp Sintering: 1600℃ atmosphere-protected sintering

  5. Precision Machining: Double-side grinding + laser cutting

  6. Surface Treatment: Chemical mechanical polishing (CMP)

  7. Full Inspection: Automated optical inspection (AOI)

Usage Guidelines

Installation Notes:

  • Recommended soldering temperature <300℃

  • Avoid mechanical impact and localized stress concentration

  • Storage humidity should be <60% RH

  • Consider CTE matching when assembling with other materials

  • Recommend using silver paste or AuSn solder for mounting

Service Commitment

  • Technical Support: Thermal simulation analysis services

  • Rapid Response: 72-hour expedited delivery for standard sizes

  • Customization: Special shapes and metallization treatments available

  • Failure Analysis: Equipped with SEM+EDS testing equipment

Technical FAQ

Q: How to select proper substrate thickness?
A: 0.63mm recommended for general power devices, ≥1.0mm for high-power applications

Q: Is multilayer wiring possible?
A: LTCC multilayer co-fired substrate solutions available

Q: What metallization options exist?
A: Supports thick-film printing, thin-film sputtering, DBC and other processes

 

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter

  • Total Annual:

    >1000000

  • Employee Number:

    >100

  • Ecer Certification:

    Verified Supplier

We are a company with many years of experience in the production of special precision ceramics and the ability to design, manufacture, process and sell structural and functional parts of various special precision ceramics.   Deyu Precision Ceramics Technology Co., Ltd. has many years of e... We are a company with many years of experience in the production of special precision ceramics and the ability to design, manufacture, process and sell structural and functional parts of various special precision ceramics.   Deyu Precision Ceramics Technology Co., Ltd. has many years of e...

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Get in touch with us

  • Reach Us
  • Dayoo Advanced Ceramic Co.,Ltd
  • No. 6, Shuangjin Street, Qiubin Industrial City, Qiubin Street, Wucheng District, Jinhua, Zhejiang
  • https://www.precision-ceramicparts.com/

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