Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Woven Glass Reinforced Hydrocarbon PCB Board ，2 Layer Rigid PCB Substrates ，30mil Rigid PCB Board | ||
Introducing our cutting-edge PCB built on Rogers RO4350B substrates. Supplied for exceptional performance and reliability, this PCB offers a wide range of features and benefits that make it ideal for advanced electronic applications.
The PCB substrates are constructed using Rogers RO4350B woven glass reinforced hydrocarbon/ceramics, which provide outstanding electrical properties. With a dielectric constant of DK 3.48 +/-0.05 at 10GHz and a dissipation factor of 0.0037 at 10GHz, this PCB enables applications with higher operating frequencies and offers low dielectric tolerance and loss.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
One of the key advantages of this PCB is its excellent stability of electrical properties across different frequencies, making it suitable for controlled impedance transmission lines and the repeatable design of filters. The RO4350B laminates also exhibit a low thermal coefficient of dielectric constant, ensuring excellent dimensional stability even in demanding thermal environments.
The low Z-axis expansion of the substrate guarantees reliable plated through holes, while the low in-plane expansion coefficient ensures stability throughout the entire range of circuit processing temperatures.
Supplied as a 2-layer rigid PCB, this product provides a reliable and cost-effective solution for electronic designs. The board dimensions are 100mm x 50mm with a thickness of 0.8mm. It features a copper layer thickness of 35 μm on both sides and a Rogers 4350B core thickness of 0.762mm (30mil). The minimum trace/space is 4/4 mils, and the minimum hole size is 0.25mm. The finished Cu weight is 1oz (1.4 mils) on the outer layers, and the via plating thickness is 20 μm. The surface finish is HASL, providing a reliable and widely-used coating for the PCB. The top silkscreen is in white, and the top solder mask is in green.
This high-quality PCB has undergone rigorous testing, including a 100% electrical test, to ensure its reliability and performance. It complies with IPC-Class-2 quality standards, meeting industry requirements for consistent and reliable performance.
With its competitive pricing, this PCB offers a cost-effective solution without compromising on quality. The RO4350B laminates can be fabricated using standard glass epoxy processes, simplifying the manufacturing process and reducing production costs.
The RO4350B PCB is CAF resistant and UL 94 V-0 rated, making it suitable for applications that require excellent performance and safety standards.
This PCB is suitable for a wide range of applications, including cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNBs for direct broadcast satellites.
With worldwide availability, you can easily integrate this high-performance PCB into your electronic designs.
For technical inquiries or further information, please contact sales10@bichengpcb.com. Our dedicated team is ready to assist you with any questions or specific requirements. Choose the high-performance RO4350B PCB for exceptional reliability, stability, and cost-effectiveness in your next electronic project.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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