Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Brand Name | Bicheng |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA | ||
High Light | RF PCB Board No Silkscreen ,RF PCB Board 60mil ,1.6mm Radio Frequency Circuit Board |
Introducing our newly shipped PCB which built on TLY-5 high frequency laminates. The TLY-5 High-Performance substrate is an advanced circuit material designed to meet the demanding requirements of various high-frequency applications. With its exceptional stability, low dissipation factor, and reliable construction, this PCB offers unparalleled performance and reliability. Let's explore the features, benefits, and applications that set the TLY-5 apart from the rest.
TLY-5 Introduction:
The TLY-5 laminates are manufactured using lightweight woven fiberglass, resulting in a dimensionally stable PCB material. The woven matrix in the TLY-5 material provides enhanced mechanical stability, making it suitable for high-volume manufacturing. The low dissipation factor makes it ideal for automotive radar applications designed at 77 GHz and other antennas operating in millimeter-wave frequencies.
Features:
Dielectric Constant (DK): The TLY-5 offers a dielectric constant of 2.2 with an impressive tolerance of 0.02 at 10 GHz and 23°C, ensuring precise and consistent electrical characteristics.
Low Loss Tangent: With a low loss tangent of 0.0009 at 10 GHz, this PCB minimizes signal loss and distortion, enabling high-quality signal transmission.
Density: The TLY-5 material has a specific gravity of 2.19 g/cm^3, providing a lightweight yet durable solution for various applications.
Moisture Absorption: The PCB exhibits a low moisture absorption rate of 0.02%, contributing to its excellent dimensional stability and resistance to moisture-related issues.
Coefficient of Thermal Expansion (CTE): The TLY-5 PCB features a CTE of 26 ppm/°C (X-axis), 15 ppm/°C (Y-axis), and 217 ppm/°C (Z-axis), ensuring stability and minimizing dimensional changes across a wide temperature range.
TLY TYPICAL VALUES | |||||
Property | Test Method | Unit | Value | Unit | Value |
DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
NASA Outgassing(% TML) | 0.01 | 0.01 | |||
NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
UL-94 Flammability Rating | UL-94 | V-0 | V-0 |
Benefits:
Dimensional Stability: The TLY-5 PCB maintains its shape and size, even under challenging conditions, ensuring reliable operation and precise circuit alignment.
Lowest Dissipation Factor: The low dissipation factor minimizes signal loss and distortion, resulting in high-quality signal transmission and improved system performance.
Low Moisture Absorption: The low moisture absorption rate enhances the PCB's durability and resistance to moisture-related issues, ensuring long-term reliability.
High Copper Peel Strength: The TLY-5 PCB boasts high copper peel strength, ensuring secure adhesion between layers and excellent mechanical reliability.
Uniform & Consistent DK: The TLY-5 material offers uniform and consistent dielectric constant, enabling predictable and accurate circuit performance.
PCB Material: | Lightweight Woven Fiberglass |
Designation: | TLY-5 |
Dielectric Constant: | 2.2 |
Dissipation Factor | 0.0009 10GHz |
Layer Count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper Weight: | 1oz (35µm), 2oz (70µm) |
Laminate Thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB Size: | ≤400mm X 500mm |
Solder Mask: | Green, Black, Blue, Yellow, Red etc. |
Surface Finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
PCB Stackup:
This PCB is a 2-layer rigid board with a copper layer of 35 μm on both sides. With a TLY-5 core thickness of 1.524 mm (60 mils), providing a sturdy and reliable design.
PCB Construction Details:
This PCB comes in a size of 127.72mm x 97.07mm with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 5/6 mils and a minimum hole size of 0.4mm. The finished board thickness is 1.6mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. The PCB features a via plating thickness of 20 μm and is finished with immersion gold for optimal performance. The PCB does not have top or bottom silkscreen or solder mask. Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring uncompromised functionality.
PCB Statistics:
This PCB contains 91 components and features a total of 238 pads, including 96 thru-hole pads and 142 top surface mount technology (SMT) pads. There are no bottom SMT pads. It also includes 161 vias, facilitating efficient electrical connections, and supports 5 nets, allowing for versatile circuit configurations.
Type of Artwork Supplied: The TLY-5 PCB is compatible with Gerber RS-274-X, a widely used standard for PCB artwork.
Quality Standard: This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.
Availability: The TLY-5 High-Performance PCB is available worldwide, making it accessible to customers across the globe.
Typical Applications:
The TLY-5 PCB is ideally suited for a wide range of applications, including:
Automotive Radar
Satellite/Cellular Communications
Power Amplifiers
LNBs, LNAs, LNCs
Aerospace
Ka, E and W band Applications
The TLY-5 High-Performance PCB enables engineers and designers in various industries to develop cutting-edge systems for high-frequency applications. With its unmatched stability, low dissipation factor, and reliable construction, the TLY-5 empowers users to create innovative solutions with confidence.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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