Multilayer PCB 2mm FR408HR Via Filled And Capped Immersion Gold

Product Specification

Introducing our high-performance Multilayer PCB built on FR408HR.This Multilayer PCB is designed for applications that demand maximum thermal performance and reliability. Crafted using Isola's patented high-performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric, this PCB offers exceptional properties that bridge the gap between thermal and electrical perspectives.

Key Features:
- Dielectric Constant (Dk): Boasting a Dk of 3.65 at 10GHz, this PCB ensures excellent signal integrity and reliable performance in high-frequency applications.
 

- Dissipation Factor: With a dissipation factor of 0.0095 at 10GHz, it minimizes signal loss, providing efficient power transmission.
 

- Coefficient of Thermal Expansion (CTE): The CTE of 16 ppm/°C in both the x and y axes ensures compatibility with copper, reducing thermal stress and enhancing reliability.
 

- Thermal Stability: Featuring a high glass transition temperature (Tg) of 230°C (DMA) and a decomposition temperature (Td) of 360°C (TGA), this PCB exhibits exceptional thermal stability.
 

- Multiple Lamination Cycles: It can withstand multiple lamination cycles, providing flexibility in the PCB manufacturing process.
 

- Lead-Free Assembly Compatibility: Designed to be compatible with lead-free assembly processes, ensuring compliance with modern industry standards.
 

- Via Filling Capability: This PCB supports via filling, enhancing electrical connectivity and improving signal integrity.
 

- CAF Resistance: With superior resistance to Conductive Anodic Filament (CAF) formation, it ensures long-term reliability and performance.
 

- Moisture Resistance: The FR408HR exhibits superior moisture resistance during reflow, safeguarding against environmental factors.

PCB Stackup:
This PCB is a 4-layer rigid PCB with the following stackup:
- Top Layer: 35 μm copper
- Prepreg: 152 μm
- Inner Layer 1: 35 μm copper
- FR408HR Core: 1.535 mm
- Inner Layer 2: 35 μm copper
- Prepreg: 152 μm
- Bottom Layer: 35 μm copper

PCB Construction Details:
- Dimensions: 170mm x 130mm (1PCS), with a tolerance of +/- 0.15mm
- Minimum Trace/Space: 4/5 mils, enabling precise circuit design and layout
- Minimum Hole Size: 0.3mm, supporting fine-pitch components and high-density interconnects
- Blind Vias: Allowing for complex routing and efficient use of available space
- Finished Board Thickness: 2.0mm, providing structural integrity and durability
- Finished Copper Weight: 1oz (1.4 mils) on outer layers, ensuring optimal conductivity
- Via Plating Thickness: 20 μm, facilitating reliable electrical connections
- Surface Finish: Immersion Gold, offering excellent solderability and corrosion resistance
- Silkscreen: Top layer in white, providing component and labeling information
- Solder Mask: Red on both top and bottom layers, protecting copper traces and preventing solder bridges
- Filled and Capped Vias: Enhancing signal integrity and improving overall PCB performance
- 100% Electrical Test: Each PCB undergoes a comprehensive electrical test prior to shipment, ensuring functionality and quality.

PCB Statistics:
- Components: 270
- Total Pads: 320
- Thru Hole Pads: 150
- Top SMT Pads: 99
- Bottom SMT Pads: 71
- Vias: 78
- Nets: 6

Quality Standard and Availability:
 

- Quality Standard: This Multilayer PCB complies with IPC-Class-2 quality standards, ensuring high reliability and performance.
 

- Availability: This high-performance PCB is available worldwide, meeting the needs of diverse industries and applications.

Typical Applications:
This Multilayer PCB finds its application in various industries, including:
 

- Consumer Electronics: From smartphones to audio/video equipment, this PCB supports the demanding requirements of modern consumer electronic devices.
 

- Server and Workstation: It provides the necessary performance and reliability for high-end server and workstation applications.
 

- Automotive: The FR408HR PCB is suitable for automotive electronics, offering robustness and thermal stability in challenging automotive environments.