Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Base material | FR-4 |
Layer count | 24 layers |
PCB thickness | 3.7mm ±0.10% |
PCB size | 400 x 212mm=1PCS |
Solder mask | Green |
Silkscreen | White |
Copper weight | 1oz |
Surface finish | Immersion gold |
Brand Name | Bicheng |
Model Number | BIC-483.V1.0 |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Base material | FR-4 | Layer count | 24 layers |
PCB thickness | 3.7mm ±0.10% | PCB size | 400 x 212mm=1PCS |
Solder mask | Green | Silkscreen | White |
Copper weight | 1oz | Surface finish | Immersion gold |
Brand Name | Bicheng | Model Number | BIC-483.V1.0 |
Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
High Light | 24 Layer FR4 PCB Board ,100 Ohm Impedance FR4 PCB Board ,FR4 High Temperature PCB |
Parameter | Value |
Layer Counts | 1-32 |
Substrate Material | FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET. |
Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
Board Outline Tolerance | ±0.0059" (0.15mm) |
PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
Thickness Tolerance(T≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm) | ±10% |
Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
Minimum Track | 0.003" (0.075mm) |
Minimum Space | 0.003" (0.075mm) |
Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
Inner Copper Thickness | 17µm--420µm (0.5oz - 12oz) |
Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
Registration (Mechanical) | 0.00197" (0.05mm) |
Aspect Ratio | 12:1 |
Solder Mask Type | LPI |
Min Soldermask Bridge | 0.00315" (0.08mm) |
Min Soldermask Clearance | 0.00197" (0.05mm) |
Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
Impedance Control Tolerance | ±10% |
Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
PCB SIZE | 400 x 212mm=1PCS |
BOARD TYPE | Multilayer PCB |
Number of Layers | 24 Layers |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | TOP LAYER 0.018mm+plating Layer 1 |
Prepreg 0.1016mm | |
PLANE 1 --- 0.035mm Layer 2 | |
CORE FR4 0.1016mm | |
GROUND 1 --- 0.035mm Layer 3 | |
Prepreg 0.127mm | |
SIGNAL 1 --- 0.018mm | |
CORE FR4 0.1524mm | |
PLANE 2 --- 0.035mm | |
Prepreg 0.1016mm | |
GROUND 2 --- 0.035mm | |
CORE FR4 0.127mm | |
SIGNAL 2 --- 0.018mm | |
Prepreg 0.1524mm | |
PLANE 3 --- 0.035mm | |
CORE FR4 0.1016mm | |
PLANE,GROUND 7 --- 0.035mm | |
Prepreg 0.127mm | |
SIGNAL 3 --- 0.018mm | |
CORE FR-4 0.1524mm | |
GROUND 3 --- 0.035mm | |
Prepreg 0.127mm | |
SIGNAL 4 --- 0.018mm | |
CORE FR4 0.1524mm | |
PLANE 4 --- 0.035mm | |
Prepreg 0.1016mm | |
GROUND 4 --- 0.035mm | |
CORE FR4 0.1016mm | |
SIGNAL 5 --- 0.018mm | |
Prepreg 0.1524mm | |
SIGNAL 6 --- 0.018mm | |
CORE FR4 0.1016mm | |
PLANE 5 --- 0.035mm | |
Prepreg 0.1016mm | |
GROUND 5 --- 0.035mm | |
CORE FR4 0.1524mm | |
SIGNAL 7 --- 0.018mm | |
Prepreg 0.127mm | |
PLANE 6 --- 0.035mm | |
CORE FR4 0.1524mm | |
SIGNAL 8 --- 0.018mm | |
Prepreg 0.127mm | |
POWER, RROUND 8 --- 0.035mm Layer 22 | |
CORE FR4 0.1016mm | |
GROUND 6 --- 0.035mm Layer 23 | |
Prepreg 0.1016mm | |
BOTTOM LAYER --- 0.018mm + plating Layer 24 | |
TECHNOLOGY | |
Minimum Trace and Space: | 5 mil / 5 mil |
Minimum / Maximum Holes: | 0.36 /3.2mm |
Number of Different Holes: | 9 |
Number of Drill Holes: | 9117 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control: | Yes, all of signal layers of 8 copper layers, 50 OHM Impedance Controlled for single ended on 5 mil track & 100 OHM for Differential routes on 5mil / 8 mil |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | FR-4 Tg170℃, er<5.4.IT-180, ITEQ Supplied |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 3.7mm ±0.10% |
PLATING AND COATING | |
Surface Finish | Immersion gold (29.1% ) 0.05µm over 3µm nickel |
Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP and Bottom. |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Via hole filling at BGA required. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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