Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Base material | FR-4 |
Layer count | 10 Layers |
PCB thickness | 1.6mm ±0.16 |
PCB size | 199 x 170mm=4PCS |
Solder mask | Green |
Silkscreen | White |
Copper weight | 1oz |
Surface finish | Immersion gold |
Brand Name | Bicheng |
Model Number | BIC-475.V1.0 |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Base material | FR-4 | Layer count | 10 Layers |
PCB thickness | 1.6mm ±0.16 | PCB size | 199 x 170mm=4PCS |
Solder mask | Green | Silkscreen | White |
Copper weight | 1oz | Surface finish | Immersion gold |
Brand Name | Bicheng | Model Number | BIC-475.V1.0 |
Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
High Light | 10 Layer Multilayer PCB Circuit Board ,1.6mm Multilayer PCB Circuit Board ,1.6mm 10 Layer PCB |
PCB SIZE | 199 x 170mm=4PCS |
BOARD TYPE | Multilayer PCB |
Number of Layers | 10 layers |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
Prepreg 0.1016mm (4mil) | |
copper ------- 35um(1oz) Plane GND | |
FR-4 0.127mm (5 mil) | |
copper ------- 18um(0.5 oz) Signal SIG1 | |
Prepreg 0.127 mm (5mil) | |
copper ------- 18um(0.5 oz) Signal SIG2 | |
Prepreg 0.127mm (5 mil) | |
copper ------- 35um(1oz) Plane PWR | |
FR-4 0.330mm (13mil) | |
copper ------- 35um(1oz) Plane GND | |
Prepreg 0.127mm (5 mil) | |
copper ------- 18 um(0.5 oz) Signal SIG3 | |
Prepreg 0.127mm (5 mil) | |
copper ------- 18 um(0.5 oz) Signal SIG4 | |
Prepreg 0.127mm (5 mil) | |
copper ------- 35um(1oz) Plane GND | |
Prepreg 0.1016mm (4mil) | |
copper ------- 35um(1oz) Signal BOT | |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minimum / Maximum Holes: | 0.25/4.2mm |
Number of Different Holes: | 15 |
Number of Drill Holes: | 850 |
Number of Milled Slots: | 10 |
Number of Internal Cutouts: | 0 |
Impedance Control: | YES. Top layer, 7.0 mil trace 50 ohms single end. Layer 3 signal layer, 4.0/4.0 mil trace-space differential impedance = 91 ohms; 4.0/6.0 mil trace-space differential impedance = 97 ohms. |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Immersion gold (30.1% ) 0.1µm over 3µm nickel |
Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing, stamp holes. |
MARKING | |
Side of Component Legend | TOP and Bottom. |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | plated through hole(PTH), minimum via 10 mils. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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