Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | RO3006 + Tg170 FR-4 |
| Layer count | 3-layer |
| PCB thickness | 0.86mm |
| PCB size | 98mm x 30mm (1 piece) |
| Copper weight | Inner: 0.5 oz (0.7 mils); Outer layers: 1 oz (1.4 mils) |
| Surface finish | OSP |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | RO3006 + Tg170 FR-4 | Layer count | 3-layer |
| PCB thickness | 0.86mm | PCB size | 98mm x 30mm (1 piece) |
| Copper weight | Inner: 0.5 oz (0.7 mils); Outer layers: 1 oz (1.4 mils) | Surface finish | OSP |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | RO3006 + Tg170 FR-4 Rogers PCB Board ，0.86mm Thickness 3-Layer PCB ，98mm x 30mm Size High-Frequency PCB | ||
This high-performance 3-layer rigid PCB is meticulously designed to meet the demanding requirements of various advanced electronic applications. With board dimensions of 98mm x 30mm (1 piece), it boasts precise construction details that ensure reliability and functionality.
PCB Specification
| Construction Detail | Specification |
| Base material | RO3006 + Tg170 FR-4 |
| Layer count | 3 layers |
| Board dimensions | 98mm x 30mm (1 piece) |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind vias | Top-Inn1, Inn1-Bot |
| Finished board thickness | 0.86mm |
| Finished Cu weight | Inner: 0.5 oz (0.7 mils); Outer layers: 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | OSP |
| Silkscreen | No |
| Solder Mask | No |
| Quality assurance (prior to shipment) | 100% Electrical test |
PCB Stack-up
The 3-layer rigid PCB has a well-engineered stack-up as follows:
| Layer/ Material | Thickness Specification |
| Copper_layer_1 | 35 μm |
| Rogers RO3006 | 10mil (0.254mm) |
| Copper_layer_2 | 35 μm |
| Prepreg | 0.1mm |
| FR-4 Core Tg170 | 0.4mm |
| Copper_layer_3 | 35 μm |
Artwork and Standards
Type of Artwork from customers: Gerber RS-274-X, a widely accepted format for PCB manufacturing data.
PCB Standard: Complies with IPC-Class-2, ensuring good quality and reliability for general electronic products.
Availability
This PCB is available worldwide, making it accessible for various global projects.
Introduction to RO3006
Rogers RO3006 laminates are ceramic-filled PTFE composites that offer exceptional electrical and mechanical stability. They are specifically designed for use in commercial microwave and RF applications. These advanced circuit materials provide a stable dielectric constant (Dk) over a range of temperatures, eliminating the step change in Dk that occurs for PTFE glass materials near room temperature.
Features of RO3006
-Ceramic-filled PTFE composites.
-Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C.
-Dissipation factor of 0.002 at 10 GHz/23°C, ensuring minimal signal loss.
-Td> 500°C, indicating high thermal resistance.
-Thermal Conductivity of 0.79 W/mK, facilitating efficient heat dissipation.
-Moisture Absorption of 0.02%, making it highly resistant to moisture-related issues.
-Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C, ensuring dimensional stability across a wide temperature range.
Benefits of RO3006
Typical Applications
This PCB, with its use of RO3006, is well-suited for a variety of applications, including:
-Automotive radar applications.
-Global positioning satellite antennas.
-Cellular telecommunications systems - power amplifiers and antennas.
-Patch antenna for wireless communications.
-Direct broadcast satellites.
-Datalink on cable systems.
-Remote meter readers.
-Power backplanes.
Conclusion
This PCB, combining RO3006 and FR-4 materials with a 3-layer stack-up and precise craftsmanship, excels in high-frequency stability, heat dissipation, and dimensional control. It ensures quality through comprehensive electrical testing, making it a practical choice with both performance and reliability for various precision electronic applications.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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