Double-Sided TP600 RF PCB Board with 5.1mm Thickness and 25mm × 25mm Size for

Product Specification

This PCB is a high-reliability double-sided (2-layer) rigid printed circuit board meticulously crafted from TP600 material. TP600 is a distinctive thermoplastic high-frequency composite, blending ceramics with polyphenylene oxide (PPO) resin, and notably, it lacks fiberglass reinforcement. Tailored for high-precision high-frequency applications, the board capitalizes on TP600's stable dielectric performance, minimal signal loss, and adaptable characteristics. These features enable it to satisfy the stringent demands of industries such as navigation, aerospace, and miniaturized antenna systems.

PCB Specifications

PCB Stack-up Configuration

TP Series Material Overview

TP series materials are industry-unique high-frequency thermoplastics, distinguished by their ceramic-PPO resin composition (no fiberglass reinforcement) and customizable dielectric properties:

Composition: Ceramic fillers blended with PPO resin; Dk can be precisely adjusted (3.0–25.0) by modifying the ceramic-to-PPO ratio, making the series adaptable to diverse high-frequency needs.

Product Differentiation: TP (unclad smooth surface), TP-1 (single-sided copper-clad), TP-2 (double-sided copper-clad); this PCB uses TP600 (Dk=6.0) in a double-sided configuration.

Key Advantages: Excellent dielectric stability, low moisture absorption, and UL 94-V0 flammability rating—critical for reliability in aerospace, defense, and navigation applications.

TP600 Key Features

TP600, the base material of this PCB, delivers targeted performance features for high-reliability high-frequency scenarios:

Precise Dielectric Constant: Dk=6.0±0.12 at 10GHz, ensuring minimal variation across the board and consistent signal propagation in frequency-sensitive circuits (e.g., satellite navigation).

Ultra-Low Dissipation Factor: 0.0010 at 10GHz, minimizing signal attenuation even in high-frequency applications, preserving signal integrity for long-distance or low-power transmissions.

Stable Temperature Coefficient of Dk (TCDk): -50 ppm/°C over -55°C to 150°C, maintaining dielectric performance across extreme temperature ranges—essential for aerospace (e.g., missile-borne) and outdoor navigation systems.

Controlled Thermal Expansion: CTE of 50 ppm/°C (X-axis), 50 ppm/°C (Y-axis), and 60 ppm/°C (Z-axis) over -55°C to 150°C, reducing mechanical stress during thermal cycling and preventing trace warpage.

Efficient Thermal Conductivity: 0.55 W/mk, facilitating heat dissipation from active components (e.g., navigation chips) in compact, enclosed designs.

Minimal Moisture Absorption: 0.01%, preventing dielectric degradation and Dk drift in humid or harsh environments—critical for long-term reliability in outdoor or aerospace applications.

Flammability Compliance: UL 94-V0 rated, meeting safety requirements for mission-critical systems (e.g., aircraft navigation, defense electronics).

Manufacturing and Quality Standards

Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with all major manufacturing equipment (e.g., laser plotters, drilling machines) and global production chains.

Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial and industrial high-frequency applications with strict controls for trace width accuracy, hole precision, and electrical continuity.

Processing Adaptability: TP600’s thermoplastic nature enables compatibility with standard PCB manufacturing processes (e.g., etching, plating), eliminating the need for specialized equipment and reducing production costs.

Availability

This PCB is available for worldwide shipping, meeting global project requirements—from aerospace and defense to industrial navigation systems.

Typical Applications:

- Global Satellite Navigation System

- missile-borne,

- fuze technology

- miniaturized antenna

Conclusion

The double-sided TP600 PCB combines the material’s unique ceramic-PPO composition (stable Dk, low loss) with precision manufacturing to address the demands of compact, high-reliability high-frequency applications. Its ultra-compact size, mechanical robustness, and compliance with strict quality standards make it an optimal solution for mission-critical systems like satellite navigation, missile-borne electronics, and miniaturized antennas.