Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers' RO4350B |
| Layer count | 6-layer |
| PCB thickness | 1.6mm |
| PCB size | 110mm × 80mm ±0.15mm |
| Copper weight | 1oz (1.4 mils) for both inner and outer layers |
| Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers' RO4350B | Layer count | 6-layer |
| PCB thickness | 1.6mm | PCB size | 110mm × 80mm ±0.15mm |
| Copper weight | 1oz (1.4 mils) for both inner and outer layers | Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 6-Layer Rogers PCB Board ，1.6mm Thickness PCB Board ，100% Electrical Test RF PCB | ||
This is a 6-layer high-performance PCB constructed with Rogers RO4350B laminate, a woven glass-reinforced hydrocarbon/ceramic composite engineered for high-frequency applications. The PCB integrates advanced material properties with precision manufacturing to deliver exceptional electrical performance, structural stability, and cost-effectiveness for RF and microwave systems.
PCB Specifications
| Parameter | Technical Details | Engineering Significance |
| Base Material | Rogers RO4350B (woven glass reinforced hydrocarbon/ceramic composite) | Combines PTFE-like electrical performance with epoxy/glass manufacturability, ideal for high-frequency applications |
| Layer Count | 6-layer rigid configuration | Supports complex signal routing with dedicated power/ground planes for EMI control |
| Board Dimensions | 110mm × 80mm ±0.15mm | Ensures dimensional stability for automated assembly and enclosure fitting |
| Minimum Trace/Space | 4/4 mils | Enables high-density routing with minimal crosstalk in RF circuits |
| Minimum Hole Size | 0.3mm | Accommodates fine-pitch components while maintaining structural integrity |
| Vias | 455 total; blind vias (L1-L4, L5-L6); 20μm plating thickness | Reduces signal path length and minimizes reflections in high-speed designs |
| Finished Thickness | 1.6mm | Provides optimal balance between structural rigidity and weight |
| Copper Weight | 1oz (35μm) for inner and outer layers | Ensures low resistance while maintaining high-frequency performance |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) | Delivers excellent corrosion resistance, solderability, and stable RF contact resistance |
| Silkscreen | White on both top and bottom layers | Facilitates component identification and assembly verification |
| Solder Mask | Green on both top and bottom layers | Protects copper traces while providing environmental resistance |
| Quality Assurance | 100% electrical testing (continuity, isolation, and impedance) | Verifies compliance with design specifications prior to deployment |
Stack-up Configuration
The 6-layer stack-up is engineered for optimal signal integrity and controlled impedance:
| Layer Sequence | Material/Component | Thickness | Function |
| 1 | Copper Layer 1 | 35μm | Primary signal layer for high-frequency traces |
| 2 | Rogers RO4350B Core | 0.254mm (10mil) | Dielectric layer with controlled Dk for impedance management |
| 3 | Copper Layer 2 | 35μm | Ground plane for Layer 1 signals |
| 4 | Prepreg RO4450F (x2) | 0.2mm | Bonding layer with compatible dielectric properties |
| 5 | Copper Layer 3 | 35μm | Power distribution layer |
| 6 | Rogers RO4350B Core | 0.508mm (20mil) | Central dielectric providing isolation between planes |
| 7 | Copper Layer 4 | 35μm | Secondary ground plane |
| 8 | Prepreg RO4450F (x2) | 0.2mm | Intermediate bonding layer |
| 9 | Copper Layer 5 | 35μm | Secondary signal layer |
| 10 | Rogers RO4350B Core | 0.254mm (10mil) | Bottom dielectric layer |
| 11 | Copper Layer 6 | 35μm | Auxiliary signal routing layer |
RO4350B Material Properties
Rogers RO4350B laminate exhibits key characteristics that enhance PCB performance:
| Property | Value | Technical Impact |
| Dielectric Constant (Dk) | 3.48 ±0.05 @ 10GHz/23°C | Ensures consistent signal propagation with minimal variation |
| Dissipation Factor (Df) | 0.0037 @ 10GHz/23°C | Minimizes signal loss in high-frequency applications |
| Thermal Conductivity | 0.69 W/m/°K | Facilitates efficient heat dissipation from active components |
| CTE (X/Y/Z) | 10/12/32 ppm/°C | Matches copper expansion to reduce thermal stress and via fatigue |
| Glass Transition Temperature (Tg) | >280°C | Maintains stability during high-temperature processing and operation |
| Water Absorption | 0.06% | Prevents performance degradation in humid environments |
| Flammability Rating | UL 94 V-0 | Enables use in applications requiring fire safety compliance |
Manufacturing and Quality
Artwork Format: Gerber RS-274-X, ensuring compatibility with standard PCB fabrication processes
Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for general electronics applications
Processing Compatibility: Compatible with standard FR-4 manufacturing workflows, eliminating the need for specialized processing required by PTFE-based materials
Application-Specific Advantages
The PCB's design and material selection make it particularly suitable for:
Cellular Base Stations: Low dielectric loss ensures efficient signal transmission in power amplifiers and antenna systems
Automotive Radar: Dimensional stability and thermal performance withstand harsh automotive environments
RF Identification Systems: Controlled impedance characteristics support reliable wireless communication
Satellite LNBs: Tight Dk tolerance enables precise phase matching in frequency conversion circuits
Availability
This PCB is available for worldwide shipping, supporting global project requirements.
Conclusion
This 6-layer RO4350B PCB combines advanced material properties with optimized stack-up construction to deliver exceptional performance in high-frequency applications. Its balance of electrical performance, manufacturability, and cost-effectiveness makes it an ideal solution for demanding RF and microwave systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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