Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Base material | Rogers' RO3206 |
Layer count | Double sided |
PCB thickness | 0.75mm |
PCB size | 63mm x 45mm |
Copper weight | 1oz (1.4 mils) |
Surface finish | Immersion Gold |
Brand Name | Bicheng |
Model Number | BIC-052.V1.0 |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Base material | Rogers' RO3206 | Layer count | Double sided |
PCB thickness | 0.75mm | PCB size | 63mm x 45mm |
Copper weight | 1oz (1.4 mils) | Surface finish | Immersion Gold |
Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
High Light | 25mil Rogers RO3206 Substrate High Frequency PCB ,0.75mm Thickness High Frequency PCB ,63mm x 45mm Size High Frequency PCB |
This high-performance printed circuit board (PCB) is meticulously engineered using Rogers' RO3206 high-frequency circuit material—a ceramic-filled laminate reinforced with woven fiberglass—to meet stringent electrical and mechanical standards, making it ideal for a wide range of high-frequency applications. Below is a comprehensive breakdown of its key specifications, construction details, and material attributes:
PCB Construction Details
Parameter | Details |
Base Material | Utilizes Rogers' RO3206, renowned for exceptional electrical performance and mechanical stability |
Layer Count | 2-layer rigid PCB |
Board Dimensions | 63mm x 45mm per piece, with a tight tolerance of +/- 0.15mm |
Minimum Trace/Space | 4/4 mils, enabling the routing of fine signals critical for high-frequency operations. |
Minimum Hole Size | 0.3mm |
Finished Board Thickness | 0.75mm |
Finished Copper Weight | 1oz (1.4 mils) on outer layers, ensuring low resistance and efficient current carrying. |
Surface Finish | Immersion Gold |
Silkscreen | White silkscreen on the top layer for clear component labeling |
Solder Mask | Blue solder mask on the top layer for protection against solder bridging |
Quality Assurance | Undergoes 100% electrical testing prior to shipment |
PCB Stack-up
The 2-layer rigid PCB features a precise stack-up designed for optimal signal integrity:
Layer | Specification |
Copper Layer 1 | 35 μm, providing a solid conductive path for signals. |
RO3206 Substrate | 0.635mm(25mil) thickness |
Copper Layer 2 | 35 μm, mirroring the top layer to maintain balanced electrical characteristics. |
Artwork and Standards
Artwork Supplied: Gerber RS-274-X, the industry-standard format for PCB manufacturing data, ensuring compatibility with production processes.
Accepted Standard: Manufactured to IPC-Class-2 specifications, ensuring high quality and reliability for general electronics applications.
RO3206 Material Overview
Rogers' RO3206 combines ceramic fillers with woven fiberglass reinforcement to deliver a balance of performance and affordability, making it a preferred choice for high-frequency designs. Its enhanced mechanical stability sets it apart within the RO3000 series.
Key Features of RO3206
Dielectric Constant: 6.15 with a tight tolerance of ±0.15 at 10 GHz/23°C, ensuring consistent signal propagation.
Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss at high frequencies.
Thermal Conductivity: 0.67 W/MK, efficient heat dissipation to prevent overheating.
Moisture Absorption: Less than 0.1%, maintaining performance in humid environments.
CTE Matching: Coefficient of thermal expansion (CTE) matched to copper (X-axis: 13 ppm/°C, Y-axis: 13 ppm/°C, Z-axis: 34 ppm/°C), reducing thermal stress during temperature fluctuations.
Copper Peel Strength: 10.7 lbs/in, ensuring strong adhesion between copper layers and the substrate for long-term reliability.
Benefits of the PCB
Woven Glass Reinforcement: Enhances rigidity, making the board easier to handle during assembly and reducing the risk of damage.
Uniform Performance: Consistent electrical and mechanical properties across the board, ideal for complex high-frequency structures.
Low Dielectric Loss: Enables superior high-frequency performance, critical for applications like wireless communications.
Low In-Plane Expansion: CTE matched to copper supports compatibility with epoxy multilayer hybrid designs and ensures reliable surface-mounted assemblies.
Dimensional Stability: Excellent stability leads to high production yields, reducing manufacturing costs.
Cost-Effectiveness: Economically priced, suitable for volume manufacturing without compromising quality.
Surface Smoothness: Allows for finer line etching tolerances, supporting the precise routing of small traces.
Typical Applications
This PCB is well-suited for a diverse range of applications, including:
-Automotive collision avoidance systems and global positioning satellite antennas
-Wireless telecommunications systems and microstrip patch antennas
-Direct broadcast satellites and datalink on cable systems
-Remote meter readers and power backplanes
-LMDS (Local Multipoint Distribution Service) and wireless broadband infrastructure
-Base station equipment for telecommunications networks
Availability: This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project needs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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