Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3006 |
| Layer count | 2-layer |
| PCB thickness | 0.2mm |
| PCB size | 20mm × 25mm |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) |
| Surface finish | Pure gold 30u" |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
Rogers TMM6 Microwave Printed Circuit Board 20mil 50mil 75mil DK6.0 RF PCB With
Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High
RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask
Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20 Mil 0.508mm
Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3006 | Layer count | 2-layer |
| PCB thickness | 0.2mm | PCB size | 20mm × 25mm |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) | Surface finish | Pure gold 30u" |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers PCB board 5mil double-sided ，RO3006 PCB pure gold plating ，double-sided PCB with 30u gold | ||
This 2-layer rigid PCB is tailored for high-performance commercial microwave and RF applications, utilizing the superior electrical and mechanical stability of Rogers RO3006 ceramic-filled PTFE composite laminates. Thanks to its ultra-compact size, precise manufacturing specifications, and consistent performance across temperature changes, it's an optimal choice for space-limited and temperature-sensitive high-frequency electronic systems.
1. PCB Specifications
The PCB’s construction is optimized for precision, miniaturization, and compatibility with high-frequency operational demands, with key parameters outlined as follows:
| Parameter | Specification |
| Base Material | Rogers RO3006 (ceramic-filled PTFE composite laminate) |
| Layer Count | 2 layers (top and bottom outer copper layers) |
| Board Dimensions | 20mm × 25mm per unit (1PCS) |
| Minimum Trace/Space | 5 mils (trace width) / 9 mils (trace spacing) |
| Minimum Hole Size | 0.2mm; no blind vias supported |
| Finished Board Thickness | 0.2mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils or 35μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Pure gold 30u" (specifically designed for wire bonding applications, ensuring excellent conductivity and bonding reliability) |
| Silkscreen | No |
| Solder Mask | No |
| Quality Assurance | 100% electrical testing conducted prior to shipment (effectively eliminating open/short circuit issues and ensuring operational reliability) |
2. PCB Stack-up Configuration
| Layer | Thickness | Function |
| Top Copper Layer (Copper_layer_1) | 35μm | Serves as the primary layer for high-frequency signal traces and top-side SMT pads, ensuring efficient signal transmission |
| Rogers RO3006 Substrate | 5 mils (0.127mm) | Acts as the dielectric core, providing exceptional electrical stability across temperature ranges to support reliable microwave and RF performance |
| Bottom Copper Layer (Copper_layer_2) | 35μm | Facilitates ground plane setup, additional signal routing, or thru-hole component connections, enhancing overall circuit functionality |
3. Quality Standards & Global Availability
Artwork Format: Gerber RS-274-X (the universal industry standard for PCB manufacturing)
Accepted Quality Standard: IPC-Class-2 (meets strict requirements for performance, durability, and consistency)
Availability: Globally accessible (support projects across different countries and regions)
4. Rogers RO3006 Substrate: Introduction, Features & Benefits
4.1 Introduction to Rogers RO3006
Rogers RO3006 laminates are high-performance ceramic-filled PTFE composites developed to deliver outstanding electrical and mechanical stability. A key advantage is their stable dielectric constant (Dk) across a wide temperature range, which eliminates the typical step change in Dk that affects standard PTFE glass materials near room temperature. This characteristic ensures consistent performance, making it a preferred choice for demanding microwave and RF systems.
4.2 Key Features of Rogers RO3006
| Property | Value | Significance |
| Material Composition | Ceramic-filled PTFE composite | Balances low signal loss with excellent mechanical strength |
| Dielectric Constant (Dk) | 6.15 ± 0.15 at 10 GHz / 23°C | Tight tolerance ensures predictable signal propagation and consistent performance |
| Dissipation Factor | 0.002 at 10 GHz / 23°C | Ultra-low signal loss critical for maintaining signal integrity in high-frequency applications |
| Decomposition Temperature (Td) | >500°C | High thermal resistance suitable for harsh high-temperature environments |
| Thermal Conductivity | 0.79 W/mK | Efficient heat dissipation protects sensitive components and prevents overheating |
| Moisture Absorption | 0.02% | Minimal water uptake ensures stable performance in humid conditions |
| Coefficient of Thermal Expansion (CTE) | X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C) | Low in-plane expansion matches copper, reducing thermal stress on PCB and components |
4.3 Core Benefits of Rogers RO3006
These features translate to tangible advantages for both circuit design and end-use performance:
Uniform Mechanical Properties Across Dielectric Constants: Compatible with a range of dielectric constants, making it ideal for multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards, enhancing design flexibility
Low In-Plane Expansion Coefficient (Copper-Matched): Matches the expansion coefficient of copper, enabling more reliable surface-mounted assemblies, suitable for temperature-sensitive applications, and ensuring excellent dimensional stability over temperature variations
Volume Manufacturing Compatibility: Supports high-volume production processes with economical laminate pricing, reducing overall production costs while maintaining high quality
5. Some Typical Applications
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
In short, this 2-layer Rogers RO3006 PCB features precise manufacturing, compliant quality, and a high-performance substrate, offering a cost-efficient and reliable solution for commercial microwave and RF applications. With its compact design, low signal loss, and temperature stability, it's ideal for next-gen high-frequency electronics development.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
Get in touch with us
Leave a Message, we will call you back quickly!