Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | TC350 |
| Layer count | 2-layer |
| PCB size | 97.5mm x 31.7 mm=1PCS, +/- 0.15mm |
| PCB thickness | 10mil |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | Electroless Nicklek, Electroless Palladium and immersion Gold (ENEPIG) |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | TC350 | Layer count | 2-layer |
| PCB size | 97.5mm x 31.7 mm=1PCS, +/- 0.15mm | PCB thickness | 10mil |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Electroless Nicklek, Electroless Palladium and immersion Gold (ENEPIG) |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
TC350 PCB is crafted from Rogers TC350 laminates, featuring a unique composition of PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. This combination results in low insertion loss and high thermal conductivity, making the TC350 an excellent choice for high-power applications. Its design ensures superior reliability and reduced operating temperatures, ideal for power amplifier and antenna systems.
With a dielectric constant (Dk) of 3.5 at 1 MHz, 1.8 GHz, and 10 GHz, the TC350 laminates maintain excellent stability across various temperatures. This stability is crucial for maximizing gain and minimizing bandwidth loss in power amplifiers and antennas. Moreover, it is key for phase and impedance-sensitive devices, such as network transformers and Wilkinson Power Dividers.
Key features include:
- Dissipation Factor: 0.0015 at 1 MHz, 0.0018 at 1.8 GHz, and 0.002 at 10 GHz
- Coefficient of Thermal Expansion (CTE): 7 ppm/°C in the x and y axes, 23 ppm/°C in the z-axis from 50°C to 150°C
- Low Thermal Coefficient of Dk: -9 ppm/°C from -40°C to 140°C
- High Thermal Conductivity: 0.72 W/mk
- Moisture Absorption: 0.05%
- T260, T288, T300: > 60 minutes
| Property | Units | Value | Test Merthod |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1 MHz | － | 3.50 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 3.50 | RESONANT CAVITY |
| @10 GHz | － | 3.50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1 MHz | － | 0.0015 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 0.0018 | RESONANT CAVITY |
| @10 GHz | － | 0.0020 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | － | ||
| TC r @ 10 GHz (-40-150°C) | ppm/ºC | -9 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 7.4x106 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 1.4x108 | |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.2x107 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 4.3x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 780 (31) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 40 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2.Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 520 | IPC TM-650 2.4.24.6 |
| 5% | °C | 567 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 7, 7 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 12 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.2 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | IPC TM-650 2.4.18.3 | |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 14/10 (97/69) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 11/8 (76/55) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | － | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.05 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.30 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.72 | ASTM D5470 |
| Specific Heat | J/gK | 0.90 | ASTM D5470 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10- 6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.01 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.01 | NASA SP-R-0022A |
| PCB Material: | Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
| Designation: | TC350 |
| Dielectric constant: | 3.5±0.05 |
| Thermal Conductivity | 0.72 W/m-K |
| Dissipation Factor | Df .002@10 GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
TC350 PCB benefits from reduced junction temperatures and improved reliability, with excellent heat dissipation and management. This leads to enhanced bandwidth utilization and efficiency for amplifiers and antennas, along with superior plated-through hole reliability.
Constructed as a 2-layer rigid PCB, it features 35 μm of copper on both layers and a core thickness of 0.254 mm (10 mil) of TC350. The board dimensions measure 97.5 mm x 31.7 mm (± 0.15 mm) with a finished thickness of 0.37 mm. It supports minimum trace and space requirements of 5/5 mils and a minimum hole size of 0.2 mm, with no blind vias. The immersion gold surface finish (ENEPIG) enhances solderability.
This PCB is supplied with artwork in the Gerber RS-274-X format and meets the IPC-Class-2 quality standard. It is available for worldwide, making it accessible to engineers globally.
Typical applications include power amplifiers, filters, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas sensitive to dielectric drift, and microwave combiners and power dividers. With its advanced thermal management and excellent electrical performance, the TC350 PCB is a reliable choice for modern electronic designs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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