Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | Rogers RO4350B Core |
| Layer count | 2-layer |
| PCB size | 45mm x 66 mm=1PCS, +/- 0.15mm |
| PCB thickness | 0.25mm |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | Immersion Silver |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | Rogers RO4350B Core | Layer count | 2-layer |
| PCB size | 45mm x 66 mm=1PCS, +/- 0.15mm | PCB thickness | 0.25mm |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion Silver |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Double Layer Immersion Silver Circuit Board ，Rogers RO4350B Immersion Silver Circuit Board ，6.6mil Immersion Silver Circuit Board | ||
Introducing the Rogers RO4350B PCB, a state-of-the-art solution designed for high-frequency applications. Made from proprietary woven glass reinforced hydrocarbon/ceramics, RO4350B offers electrical performance comparable to PTFE/woven glass while maintaining the manufacturability advantages of epoxy/glass composites. This material is engineered to provide tight control over dielectric constant (Dk) and low loss, all at a fraction of the cost of conventional microwave laminates.
RO4350B laminates do not require special through-hole treatments or handling procedures, making them easier to work with than PTFE-based materials. Rated UL 94 V-0, they are ideal for active devices and high-power RF designs, ensuring reliability and performance.
Key Features
1. Dielectric Constant: 3.48 ± 0.05 at 10 GHz/23°C, ensuring reliable signal integrity for RF applications.
2. Dissipation Factor: Low at 0.0037 at 10 GHz/23°C, minimizing signal loss.
3. Thermal Conductivity: 0.69 W/m/°K, facilitating effective heat management.
4. Thermal Coefficient of Expansion (CTE): X axis at 10 ppm/°C, Y axis at 12 ppm/°C, and Z axis at 32 ppm/°C, providing excellent dimensional stability.
5. High Tg Value: Greater than 280 °C, ensuring stability during thermal processing.
6. Water Absorption: Low at 0.06%, enhancing reliability in various environments.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits
1. Multi-Layer Board Compatibility: Ideal for MLB constructions, ensuring excellent dimensional stability.
2. Cost-Efficient Processing: Processes like FR-4, resulting in lower fabrication costs.
3. Reliable Thermal Performance: Low Z-axis CTE provides consistent plated through-hole quality, even under thermal stress.
PCB Specifications
This PCB is designed as a 2-layer rigid board with dimensions measuring 45 mm x 66 mm, with a tolerance of ±0.15 mm. It features two copper layers, each with a thickness of 35 μm, sandwiching a core of Rogers RO4350B material that is 0.168 mm (6.6 mil) thick. The finished board thickness is 0.25 mm, and the outer layers have a copper weight of 1 oz (1.4 mils).
The via plating is set at a thickness of 20 μm, and the surface finish is achieved through immersion silver. Notably, the board does not include silkscreen or solder mask on either side. Prior to shipment, each PCB undergoes a rigorous 100% electrical testing process to ensure reliability and performance.
Artwork and Standards
The Rogers RO4350B PCB comes with Gerber RS-274-X artwork and meets IPC-Class-2 quality standards, ensuring reliability and performance in demanding applications.
Availability
Our Rogers RO4350B PCBs are available for worldwide shipping, making it easy for engineers and designers to access this advanced technology for their projects.
Typical Applications
The Rogers RO4350B PCB is ideal for a wide range of applications, including:
-Cellular base station antennas and power amplifiers
-RF identification tags
-Automotive radar systems and sensors
-LNBs for direct broadcast satellites
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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